National Instruments announced that it is the first vendor to execute a Manufacturing Test License (MTL) agreement with Broadcom Corp. The MTL agreement authorizes NI to provide manufacturing test solutions and modifiable application source code to Broadcom® wireless LAN and Bluetooth device customers.
Micron Technology Inc., one of the world's leading providers of advanced semiconductor solutions, announced its collaboration with Broadcom Corp. to develop the industry's first solution designed for customers challenged by an intrinsic DDR3 timing parameter called tFAW, or four activate window.
Skyworks Solutions Inc., an innovator of high performance analog semiconductors enabling a broad range of end markets, announced that its industry leading wireless connectivity front-end modules (FEMs) are being leveraged by Broadcom Corp. for use in several of the company’s 5G WiFi solutions, enabling some of the fastest download speeds available in access points, routers, DSL/cable gateways, PCs, smartphones and tablets.
ABI Research’s GNSS IC vendor matrix concluded that, overall, Qualcomm is the leading GPS IC vendor, followed by Broadcom in second place, and CSR in third. The vendor matrix compares companies on 15 criteria across the broader categories of GNSS Innovation and Implementation. Qualcomm’s domination of cellular GPS IC shipments courtesy of its embedded platform strategy, coupled with its strong IZat and Gimbal platforms means it is well placed to remain at the top in 2013/14.
TriQuint Semiconductor Inc., a leading RF solutions supplier and technology innovator, announced that its TriConnect® 5 GHz WLAN front-end modules and premium LTE / Wi-Fi coexistence filters are being leveraged by Broadcom Corp. for use in the company's 5G Wi-Fi reference designs. The 5G Wi-Fi (IEEE 802.11ac) technology delivers faster throughput, longer operating range and extended battery life for smartphones, tablets and other consumer devices.
Broadcom has been ranked number one vendor in three recent competitive assessments released by ABI Research on wireless connectivity IC markets. One was for overall wireless connectivity ICs, another on Bluetooth ICs, and a final on Wi-Fi ICs.
Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, delivered the world's first monolithic silicon germanium (SiGe) RF front-end (FE) device for the 5th generation of Wi-Fi devices based on IEEE 802.11ac standard. Benefitting from its industry-leading integration levels and utilizing high-performance SiGe process technology, the new LX5586 RF FE provides significant performance and cost advantages over existing technologies.
The market for mobile handset IC, including platform and connectivity ICs, surpassed $32 billion in 2011 and is forecast to grow a further 11 percent in 2012 to reach $35.7 billion. Growth is being led largely by the smartphone segment, with ultra-low end handsets also growing strongly. “Qualcomm stands out as the market leader with 26 percent overall share in 2011,” stated Peter Cooney practice director, of semiconductors, “its continuing focus on the handset market and in particular its efforts to increase platform integration look set to further strengthen Qualcomm’s hold on the market in the near term.”
The total Bluetooth IC market (including stand alone and combo ICs) is expected to reach $4.3 billion in 2012 — an increase of 21% on 2011. Revenues are forecast to grow at a compound growth rate of over 20% to reach almost $12 billion by 2017.