- Buyers Guide
A wide range of amplifiers, transmitters, microwave power modules (MPMs), travelling wave tubes and high voltage power supplies will be on display by TMD Technologies at this year's IEEE International Microwave Symposium in Seattle, WA, USA.
Laird Technologies Inc., a global technology company, will exhibit solutions for the wirelessly connected world at CTIA 2013. Embedded wireless, active thermal management and telematics products will be on display, allowing Laird to showcase a range of wireless capabilities. The CTIA Conference and Exhibition will be held at the Sands Expo and Convention Center in Las Vegas, May 21-23. Laird will exhibit at booth #6136.
Medical devices that send small amounts of data wirelessly will be able to run for months or even years on a coin cell battery when they use new Bluetooth Smart™ modules announced today by global technology leader Laird Technologies.
Richardson RFPD Inc. announced the launch of a new website resource focused exclusively on Silicon carbide technology for energy and power applications.
RF Micro Devices Inc. announced the expansion of the company's entry solutions product portfolio to include multiple new solutions for 2G and 3G entry smartphones. The new RF solutions are designed to solve the increasingly complex RF requirements of entry-level 2G and 3G smartphones related to cost, band count, and thermal dissipation.
Anaren Inc. announced that its Anaren Integrated Radio (AIR) module team is partnering with Austin, Texas-based middleware developer Emmoco to create the AIR Support for BLE solution. As a guest supplier at the Premier-Farnell booth (#220, Hall 5) in the Embedded World 2013 exhibition, the AIR team will be explaining its technology concept for fast-emerging Bluetooth Low Energy (BLE) applications -- and will also be actively developing a pool for "beta-testers" for the upcoming AIR Support for BLE solution, which is scheduled for release in the spring/summer of 2013.
TriQuint Semiconductor Inc., an RF solutions supplier and technology innovator, is enabling next-generation 802.11ac Wi-Fi and a superior wireless user experience with the introduction of three new high-performance WLAN front-end modules and two advanced Wi-Fi/4G coexistence filters.
Pulse Electronics Corp., a leading provider of electronic components, introduces RF MoCA (Multimedia over Cable Alliance) filter modules that are pin-in-paste compatible. Pin-in-paste manufacturing uses a reflow instead of a wave soldering process to apply solder to the components, saving time, increasing throughput, and reducing costs. These filters are compliant with MoCA 1.1 and 2.0 requirements and are qualified with leading MoCA silicon vendors.
Based on 2012 shipment data, where cellular module revenues grew 21 percent YoY, ABI Research expects to see a further increase in shipments, reaching nearly 100 million units by 2015.
Laird Technologies Inc. has released Android 2.3 Gingerbread support for its Summit 40 Series radio modules, which support dual-band 802.11n (802.11a/b/g/n) and Bluetooth 2.1.
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