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LPKF has announced its newest instructional webinar, 3D Circuitry on Thermoplastics: Creating Molded Interconnect Devices with Laser Direct Structuring. This original presentation will be broadcast live on Thursday, April 18 at 11:00 am PDT (2:00 EDT).
EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design organized by Microwave Journal and Horizon House has announced its line-up of speakers for the opening plenary session to be held on March 12th at the Beijing International Convention Center.
Richardson RFPD Inc. announces its attendance and participation at the 2012 IEEE International Microwave Symposium (IMS). IMS, along with the RFIC symposium and the ARFTG conference, is part of Microwave Week, the largest gathering of radio frequency (RF) and microwave professionals, and the most important forum for the latest and most advanced research in these fields.
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