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Items Tagged with 'planar'

ARTICLES

PMI acquires HARI LLC

May 15, 2013

Planar Monolithics Industries Inc. (PMI) has announced that effective April 30 2013, PMI acquired100% of all the assets & property of Hari LLC


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IMS introduces non-magnetic chip resistors with ultra leach resistant terminals

March 25, 2013

International Manufacturing Services Inc. (IMS), a manufacturer of high quality thick film resistors, terminations, attenuators, couplers, thermal management devices, planar dividers and planar filters to the electronics industry, has introduced a new type of chip resistor terminal which are non-magnetic and ultra leach resistant.


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IMS introduces HVI series high voltage surface mount chip resistors to 3kV

MMICs&More
January 29, 2013

International Manufacturing Services Inc. (IMS) introduces its line of HVI Series chip resistors especially suited for high voltage applications.


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UltraSource releases new thin film microcircuit CopperVia

January 16, 2013

Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada.


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AWR Connected for Antenna Magus Version 4.1 - expands portfolio

EDAFocus
November 15, 2012

AWR Corp., the innovation leader in high-frequency EDA, and Magus (Pty) Ltd, developers of the leading antenna synthesis product Antenna Magus, announce Antenna Magus Version 4.1, which adds four new antenna types:


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UltraSource Inc. releases new thin film microcircuit CopperVia

June 7, 2012

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


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