- Buyers Guide
Michael Casper, president and CEO of UltraSource Inc., a thin film microchip manufacturer, is pleased to announce the update of an application note on the company's website titled: “How Your CAD File Affects the Success of Your New Thin Film Design.”
Bonding Source introduces the most versatile epoxy board mount press in the industry. The press is used to attach PCBs to carriers and housings with epoxy film. The press utilizes house air and works off a pneumatic piston to control the psi required for curing film epoxies under pressure.
UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that the company now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding.
International Manufacturing Services Inc. (IMS) introduces its line of HVI Series chip resistors especially suited for high voltage applications.
Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada.
Stackpole's RAVN Series is a thin film based chip array designed for applications with tight tolerance or tight TCR requirements. The Series offers four resistive elements in a 1.6 x 3.2 mm package with resistance values from 100 Ω up to 33 K Ω in a 0.1 percent tolerance.
Laird Technologies Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced the release of its new eTEG Series Thin Film Energy Harvesting product line.
Vishay Precision Group Inc. announced that its Vishay Foil Resistors (VFR) brand has released a new video that compares the stability and accuracy of three different current sense precision resistor technologies used in solar panels: thick film, metal band, and next-generation Bulk Metal® Z-Foil. The short video demonstrates how an increase in ambient temperature results in a change in accuracy and stability in thick film and metal band resistors; but has no effect on the Z-Foil resistor.
Vishay Intertechnology Inc. introduced the industry's first wirebondable thin film chip resistors with compact 40 x 40 mil (1 x 1 mm) footprints to feature high resistance to 100 MΩ. The new CS44 <http://www.vishay.com/doc?60114> series features low TCR down to ± 50 ppm/°C and tolerances to ± 0.5 %.
Cornell Dubilier Electronics Inc. announced that it has acquired the Orange Drop® film capacitor product lines and all other radial product lines from capacitor maker SBE Inc. (dba SB Electronics) of Barre, VT.
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