Items Tagged with 'laird'

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When the IEEE International Microwave Symposium opens early next month, Laird Technologies Inc., a global technology company, will be there to showcase its best-in-class EMI and microwave materials to design engineers looking for solutions with proven results. Addressing EMI issues early in the design process is critical, and Laird’s customizable solutions are ideal for engineers working at VHF, UHF, microwave and millimeter wave frequencies in industries ranging from wireless and telecommunications to medical and military. 

Laird Technologies Inc., a global technology company, will exhibit solutions for the wirelessly connected world at CTIA 2013. Embedded wireless, active thermal management and telematics products will be on display, allowing Laird to showcase a range of wireless capabilities. The CTIA Conference and Exhibition will be held at the Sands Expo and Convention Center in Las Vegas, May 21-23. Laird will exhibit at booth #6136.  

Medical devices that send small amounts of data wirelessly will be able to run for months or even years on a coin cell battery when they use new Bluetooth Smart™ modules announced today by global technology leader Laird Technologies. 

Laird Technologies, a global technology company, announced that its advanced, first-to-market, high-speed wireless antenna system has been deployed at the Singapore Changi Airport, the 15th busiest airport in the world. 

Laird Technologies Inc. has released Android 2.3 Gingerbread support for its Summit 40 Series radio modules, which support dual-band 802.11n (802.11a/b/g/n) and Bluetooth 2.1.  

Laird Technologies Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced it has expanded its EMI Metals product line with SMD Grounding Contacts. The EMI product line is a core piece of Laird’s value proposition to deliver solutions for today’s smaller, more advanced electronics. As part of Laird Performance Materials (LPM), these products provide vital protection for a wide range of high-performance electronic devices. 

Laird Technologies Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced the release of two new Tflex™ series thermal gap fillers.  

Laird Technologies Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced the release of its new eTEG Series Thin Film Energy Harvesting product line.  

Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced it will attend the SAE Convergence Conference and Exhibition. The event will take place at the Cobo Center in Detroit, Michigan, October 16-17, 2012. Laird Technologies will exhibit at booth #919.

Laird Technologies Inc., a designer and supplier of customized performance-critical components and systems for advanced electronics and wireless products, announced it will be attending the 2012 International Microwave Symposium and Exhibition. The event is taking place at the Palais des Congrès de Montréal in Montreal, Canada, June 19-21, 2012. Emerson & Cuming Microwave Products, a unit of Laird Technologies can be found at booth #2308.