Items Tagged with 'thermal'

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Rogers Corp. to Exhibit Advanced Circuit and Thermal Management Materials at DesignCon 2017

Rogers Corp.'s Advanced Connectivity Solutions (ACS) will feature examples of its high-performance circuit and thermal management materials for the most demanding electronic designs and working environments at DesignCon 2017, January 31-February 2, 2017 (exhibition from February 1-2, 2017) in the Santa Clara Convention Center (Santa Clara, CA). DesignCon is a premiere event for electronic design engineers working on circuit and system levels.


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ANSYS AIM 17.2: Expanding upfront simulation for the design engineer

With the latest release of ANSYS AIM, organizations can accelerate product design through upfront simulation, mitigate late-stage design changes, and reduce the number of costly physical prototypes. Now available, ANSYS AIM 17.2 enhances engineering simulation for thermal management, extends collaboration between designers and analysts, and brings upfront simulation to Japanese engineers in their own language.


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Simulation apps create new business opportunities for engineers at BE CAE & Test

Engineers at BE CAE & Test (Catania, Italy) have taken the simulation process well beyond the typical approach of “run a test / deliver a report.” Instead, using the COMSOL Multiphysics software and the Application Builder, they have created a series of easy-to-use custom applications that perform state-of-the-art virtual prototyping of their customers’ surface-mount device designs. The apps hide the complexity of the underlying detailed model, yet still provide access to the powerful functionality of the simulation.


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Keysight Technologies demonstrates electro-thermal solver at IMS2015

Keysight Technologies Inc. demonstrated the Advanced Design System (ADS) Electro-Thermal Simulator at the IEEE MTT-S International Microwave Symposium (IMS) 2015, Booth 739, Phoenix, May 17-22. The solution provides accurate, temperature aware IC simulation results by using device temperatures that take into account thermal coupling and thermal characteristics of the RFIC/MMIC component packaging.


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