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White Papers

Understanding Grounding Concepts in EM Simulators

This white paper, written by EM expert Dr. John Dunn, demonstrates the importance of correctly selecting and assigning “ground” within EM simulators and how it is essential for successfully predicting the performance of board, package, and their associated interconnects.

Understanding Long-Term Evolution Fundamentals and Measurement Challenges

With release of the latest version of Release 8 of the 3rd Generation Partnership Project (3GPP) in June 2009, the core LTE specification has stabilized. 3GPP Release 8 also encompasses a considerable number of interim enhancements embodied in Evolved High-Speed Packet Access (eHSPA), also known as HSPA+.

Microwave Integrated Circuits: New Achievements from a “Mature” Technology

For more than 60 years, microwave technology has been synonymous with Microwave Integrated Circuits (MICs). The first MICs appeared in the 1940s, just over a decade after the first microwave circuits were introduced in waveguide form. Now, even though monolithic MICs (MMICs) have revolutionized (and made possible) most of today’s wireless-enabled devices, products based on MIC fabrication techniques remain the bulk of the output of the microwave industry.

Guidelines for Choosing RF and Microwave Products: Part 1

How to specify RF and microwave filters.

Consider the Costs of Not Migrating Your Test System

Test system migration and modernization doesn’t have to be expensive and fraught with hassle. In fact, carefully planned migration can maximize test-system efficiency, performance and readiness while providing meaningful cost savings.

Designing RF, Mixed-Technology Printed Circuit Boards

Printed circuit boards with both analog and digital circuitry are nearly universal. Recently, integration of RF circuitry in addition to the mixed analog and digital circuits has become more common. Problems arise because the PCB design tools have been ignorant of RF shapes printed on the board and a great deal of manual work was required to achieve a functioning product. Now, Mentor has teamed with RF Design Tool suppliers, such as Agilent, to bring the first integrated RF-PCB system tool.

SISO to MIMO: Moving Communications from Single-Input

Mark Elo, Marketing Director of RF Products, Keithley Instruments

50 V LDMOS: An Ideal RF Power Technology for ISM, Broadcast, and Radar Applications

RF LDMOS (RF Laterally Diffused MOS), hereafter referred to as LDMOS, is the dominant device technology used in high power wireless infrastructure power amplifier (PP applications for frequencies ranging from less than 900 MHz to 3.8 GHz.

Upfront RF Planning Speeds System-level Analysis

White paper discussing the advantages of dedicated system-level tool over spreadsheets.

Optical Lithography Based Low Cost PHEMT Process

DC to 85GHz TWA and Ka-band 4.9W Power Amplifier Using an Optical Lithography Based Low Cost PHEMT Process

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