advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

White Papers

CVD Diamond High Power Resistors and Terminations

December 15, 2012

Commonly used substrates for high power resistors and terminations are Beryllia, Aluminum Nitride, and to alesser extent, Boron Nitride and Silicon Carbide. While these materials are known for their superior thermal properties, none of them come even close to matching the thermal conductivity of CVD Diamond.

Biasing Constant Current MMICs

December 7, 2012

The Mini-Circuits family of microwave monolithic integrated circuit (MMIC) Darlington amplifiers offers the RF designer multi-stage performance in packages that look like a discrete transistor.

Secondary Radar Transponder Testing Using the 8990B Peak Power Analyzer

November 14, 2012
Learn more about the background of radar systems and the role of transponders in these systems, and why periodic maintenance and calibration of transponder test sets are important for ensuring aviation safety. This application note provides examples of how to effectively test transponders to validate their performance and function, covering topics such as interrogation and reply transmit power and pulse profiling, double pulse spacing, and reply delay timing measurement.

RF Switch Performance Advantages of UltraCMOS Technology over GaAs Technology

November 14, 2012
In RF systems, switches are as common as amplifiers, mixers, and PLLs. While many technologies yield good active RF devices, few yield good RF switches. Superior switches are available in Peregrine's UltraCMOS process technology.

Radar and Radio Range Simulation

November 14, 2012
Fiber Optic Delay Line systems (FODL) are used in test and development laboratories to eliminate outdoor range testing of radio and radar systems. Outdoor range testing is costly, complex, and time-consuming.

Superposition vs. True Balanced: What's Required for Your Signal Integrity Application

November 14, 2012
The True Balanced/Differential technique uses two sources to create actual differential and common-mode stimuli, hence the shortened name true-balance. This white paper offers guidance to signal integrity designers on the differences between these approaches and which one may best fit their need.

Amplifier Poster

October 18, 2012

A ready reference poster of multiple RF/microwave amplifier graphs and tables from AR RF/Microwave Instrumentation .

Selecting RF Chip Capacitors for Wireless

October 16, 2012

With today's advancements in wireless technology, greater emphasis is being placed on component performance. This article will provide a discussion of ceramic and porcelain chip capacitors and understanding their behavior in RF product designs. They are an excellent choice for wireless applications where volumetric efficiency, reliability and RF performance are an absolute must.

What Is a Vector Signal Transceiver (VST)?

October 16, 2012

Software-defined RF test system architectures have become increasingly popular over the past several decades. Almost every commercial off-the-shelf (COTS) automated RF test system today uses application software to communicate through a bus interface to the instrument. As RF applications become more complex, engineers are continuously challenged with the dilemma of increasing functionality without increasing test times, and ultimately test cost. While improvements in test measurement algorithms, bus speeds, and CPU speeds have reduced test times, further improvements are necessary to address the continued increase in the complexity of RF test applications.

Signal Integrity:Frequency Range Matters!

October 15, 2012

Higher data rates introduce new challenges for test solutions. There are several 20+ Gbit/s high speed standards (Table 1) that are driving the upper end of the test spectrum to 70 GHz and even 110 GHz. Accurate measurements are needed to better understand higher order harmonics, as will new challenges related to conductor skin effects and dielectric losses on PC boards, along with the design trade-offs related to choices of vias, stackups, and connector pins.

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement