- Buyers Guide
Commonly used substrates for high power resistors and terminations are Beryllia, Aluminum Nitride, and to alesser extent, Boron Nitride and Silicon Carbide. While these materials are known for their superior thermal properties, none of them come even close to matching the thermal conductivity of CVD Diamond.
The Mini-Circuits family of microwave monolithic integrated circuit (MMIC) Darlington amplifiers offers the RF designer multi-stage performance in packages that look like a discrete transistor.
A ready reference poster of multiple RF/microwave amplifier graphs and tables from AR RF/Microwave Instrumentation .
With today's advancements in wireless technology, greater emphasis is being placed on component performance. This article will provide a discussion of ceramic and porcelain chip capacitors and understanding their behavior in RF product designs. They are an excellent choice for wireless applications where volumetric efficiency, reliability and RF performance are an absolute must.
Software-defined RF test system architectures have become increasingly popular over the past several decades. Almost every commercial off-the-shelf (COTS) automated RF test system today uses application software to communicate through a bus interface to the instrument. As RF applications become more complex, engineers are continuously challenged with the dilemma of increasing functionality without increasing test times, and ultimately test cost. While improvements in test measurement algorithms, bus speeds, and CPU speeds have reduced test times, further improvements are necessary to address the continued increase in the complexity of RF test applications.
Higher data rates introduce new challenges for test solutions. There are several 20+ Gbit/s high speed standards (Table 1) that are driving the upper end of the test spectrum to 70 GHz and even 110 GHz. Accurate measurements are needed to better understand higher order harmonics, as will new challenges related to conductor skin effects and dielectric losses on PC boards, along with the design trade-offs related to choices of vias, stackups, and connector pins.