- Buyers Guide
Dual-polarity supplies are commonly needed to operate electronics such as op amps, drivers, or sensors, but there is rarely a dual-polarity supply available at the point of load. The LTCÃÂ®3260 is an inverting charge pump (inductorless) DC/DC converter with dual low noise LDO regulators that can produce positive and negative supplies from a single wide input (4.5V to 32V) power source. It can switch between high efficiency Burst ModeÃÂ® operation and low noise constant frequency mode, making it attractive for both portable and noise-sensitive applications.
Commonly used substrates for high power resistors and terminations are Beryllia, Aluminum Nitride, and to alesser extent, Boron Nitride and Silicon Carbide. While these materials are known for their superior thermal properties, none of them come even close to matching the thermal conductivity of CVD Diamond.
The Mini-Circuits family of microwave monolithic integrated circuit (MMIC) Darlington amplifiers offers the RF designer multi-stage performance in packages that look like a discrete transistor.
A ready reference poster of multiple RF/microwave amplifier graphs and tables from AR RF/Microwave Instrumentation .
With today's advancements in wireless technology, greater emphasis is being placed on component performance. This article will provide a discussion of ceramic and porcelain chip capacitors and understanding their behavior in RF product designs. They are an excellent choice for wireless applications where volumetric efficiency, reliability and RF performance are an absolute must.
Software-defined RF test system architectures have become increasingly popular over the past several decades. Almost every commercial off-the-shelf (COTS) automated RF test system today uses application software to communicate through a bus interface to the instrument. As RF applications become more complex, engineers are continuously challenged with the dilemma of increasing functionality without increasing test times, and ultimately test cost. While improvements in test measurement algorithms, bus speeds, and CPU speeds have reduced test times, further improvements are necessary to address the continued increase in the complexity of RF test applications.