Whitepapers

3G/4G Multimode Cellular Front End Challenges, Part 3: Impact on Power Amplifier Design

Key Concepts Discussed:
• Power amplifier background.
• Low Power Mode versus DC-DC converters: impact on battery current.
• Quadrature versus single-ended architectures.

GaAs in Space

TriQuint Semiconductor

Consider the Costs of Not Migrating Your Test System

Test system migration and modernization doesn’t have to be expensive and fraught with hassle. In fact, carefully planned migration can maximize test-system efficiency, performance and readiness while providing meaningful cost savings.

Designing RF, Mixed-Technology Printed Circuit Boards

Printed circuit boards with both analog and digital circuitry are nearly universal. Recently, integration of RF circuitry in addition to the mixed analog and digital circuits has become more common. Problems arise because the PCB design tools have been ignorant of RF shapes printed on the board and a great deal of manual work was required to achieve a functioning product. Now, Mentor has teamed with RF Design Tool suppliers, such as Agilent, to bring the first integrated RF-PCB system tool.

SISO to MIMO: Moving Communications from Single-Input

Mark Elo, Marketing Director of RF Products, Keithley Instruments

Optical Lithography Based Low Cost PHEMT Process

DC to 85GHz TWA and Ka-band 4.9W Power Amplifier Using an Optical Lithography Based Low Cost PHEMT Process

Buying a Signal Analyzer

Keithley Instruments

De-mystifying Single Carrier FDMA: The New LTE Uplink

This article focuses on the physical layer (“Layer 1”) characteristics of the LTE uplink, describing the new Single-Carrier Frequency Division Multiple Access (SC-FDMA) transmission scheme and some of the measurements associated with it. Understanding the details of this new transmission scheme and measurements is a vital step towards developing LTE UE designs and getting them to market.