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Spacecraft Payload for MSC Networks

By Durban University of Technology (DUT)

Understanding Long-Term Evolution Fundamentals and Measurement Challenges

With release of the latest version of Release 8 of the 3rd Generation Partnership Project (3GPP) in June 2009, the core LTE specification has stabilized. 3GPP Release 8 also encompasses a considerable number of interim enhancements embodied in Evolved High-Speed Packet Access (eHSPA), also known as HSPA+.

Solutions for PCB Electromagnetic Interference

In today’s world of highly complex Printed Circuit Board (PCB) designs, designing to meet electromagnetic compatibility (EMC) targets is a necessity. A step that is often times neglected during the early design stage is the design of a robust power delivery network (PDN).

A Comparison Between Thin Film and Thick Film Capacitors

By Ron Demcko, AVX Fellow and Applications Engineering Manager

Advances in S-Band Radar Technology

By Integra Technologies Inc.. Reducing overall system cost through higher levels of integration.

Microwave Integrated Circuits: New Achievements from a “Mature” Technology

For more than 60 years, microwave technology has been synonymous with Microwave Integrated Circuits (MICs). The first MICs appeared in the 1940s, just over a decade after the first microwave circuits were introduced in waveguide form. Now, even though monolithic MICs (MMICs) have revolutionized (and made possible) most of today’s wireless-enabled devices, products based on MIC fabrication techniques remain the bulk of the output of the microwave industry.

Guidelines for Choosing RF and Microwave Products: Part 1

How to specify RF and microwave filters.

Tackling the Challenges of Pulsed Signal Measurements

This Application Note describes chracterization of devices used in radar systems with pulsed signals.

Advancements in Process Residue

by Morgan Technical Ceramics

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