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Title: TSV and Interposer: modeling, design and characterization
Date: October 4th, 2012
Time: 8am PT, 11am ET, 5pm CET
Abstract:
3D ICs promise “more than Moore” integration by packing a lot of functionality into small form factors. Interposers along with TSVs play an important role in 3D integration from an electrical, thermal and mechanical point of view.
The goal of this webinar is to demonstrate a complete design methodology for TSVs used in interposers by means of three 3D full wave electromagnetic simulations.
A comparative analysis of various configurations of signal delivery networks in 3D interposers for high speed signal transmission is presented. Based on the results, design guidelines are outlined with the objective of minimizing the crosstalk among TSVs, reducing the insertion loss and generally improving the electrical performance of interconnections in silicon and glass interposers.
Presenter bio:
Darryl Kostka received the B.Eng. and M.Eng. degrees in Electrical Engineering from Carleton University, Ottawa, Canada in 2006 and McGill University, Montreal, Canada in 2009 respectively.
He is currently working as an Application Engineer at CST of America in the San Francisco Bay Area where he is involved in the signal integrity and power integrity analysis of high-speed digital systems including packages and PCBs as well as electromagnetic compatibility/interference modeling.
