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IC, Laminate, Package Multi-Technology PA Module Design Methodology

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8/2/12 1:00 pm to 8/2/12 2:00 pm EDT

Agilent EDA 468x60 2aug12


Innovations in EDA Webcast

IC, Laminate, Package Multi-Technology PA Module Design Methodology

Date: August 2, 2012

Time:10:00 AM PT/ 1:00 PM ET/ 5:00 PM UTC

Why this webcast is important:
Today’s RF and Microwave designers are confronted with challenging requirements. Designers must design complex ICs in multi-chip RF modules with multiple technologies. This requires the IC’s, package, laminate, and PCB to be designed together where EM interactions between components and substrates can be accurately modeled. This task is best performed in a simplified integrated design flow.

This webcast will detail an effective solution to these challenges and will present recent advances and breakthrough capabilities in ADS 2012 for today’s challenging multi-technology co-design in RF modules and System-in-Package (SiP). Various examples will be presented in order to clearly illustrate these new capabilities.

Who should attend:
Engineering Designers, Managers, and EDA tool decision makers involved in a design team responsible for developing Multi-Technology RF designs for the latest commercial wireless or Aerospace-Defense applications.

Presenter: Jack Sifri – MMIC Design Flow Specialist

Presenter Bio:
Jack Sifri is the MMIC Design-Flow Specialist and Product Manager of MMIC simulation technologies at Agilent EEsof EDA. Before joining Agilent, Jack had 14 years of experience in designing RF and Microwave circuits for space applications at Hughes Aircraft Co. Jack has published many articles on LNA Design Techniques, MMIC and Statistical Design Methodology and Design for Manufacturing, Non-Linear X-Parameters, and on-Circuit Simulation Technologies. Jack holds a Masters degree in Electrical Engineering from the University of California at Los Angeles and an MBA from the University of Southern California.


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