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Material and PCB Fabrication Considerations for the Different Bands of 5G

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When

6/20/18 11:00 am to 6/20/18 12:00 pm EST

Event Description

Technical Education Webinar Series

Title: Material and PCB Fabrication Considerations for the Different Bands of 5G

Date: June 20, 2018

Time: 8am PT / 11am ET

Sponsored by: Rogers Corporation

Presented by: John Coonrod, Technical Marketing Manager, Rogers Corporation, Advanced Connectivity Solutions

Abstract:

5G technology is very different than previous communication infrastructures and one noteworthy characteristic is that 5G will use multiple bands of frequency for its applications. On the surface, different bands of frequency may not appear that significant, however, the choice of high frequency materials and PCB fabrication considerations can be very different for applications at significantly different frequencies. Additionally, some of the PCB constructions for 5G are more complicated than the PCB’s that were used with earlier communication systems. Furthermore, the potential for more demanding thermal management issues with 5G appears to be a valid concern.

This webinar will address the different considerations for specifying the proper high frequency materials to be used for PCB’s in 5G applications, which are operating at different frequency bands. The webinar will also give RF performance comparisons of these different materials as well as address multiple issues associated with PCB fabrication and thermal management. The following agenda will be followed:

  • High frequency circuit material considerations for sub 6 GHz and millimeter-wave 5G applications
  • Circuit material properties to consider for multilayer 5G applications at different frequencies
  • Material and PCB attributes which are important to understand for thermal management

Presenter Bio:

John Coonrod is the Technical Marketing Manager for Rogers Corporation, Advanced Connectivity Solutions Division. John has 30 years of experience in the Printed Circuit Board industry. About half of this time was spent in the Flexible Printed Circuit Board industry regarding circuit design, applications, processing and materials engineering. The past fifteen years have been spent supporting High Frequency Circuit materials involving circuit fabrication, providing application support and conducting electrical characterization studies. John is the Chair for the IPC D24C High Frequency Test Methods Task Group and holds a Bachelor of Science, Electrical Engineering degree from Arizona State University.