Find Events

or

Design Considerations and Tradeoffs for Microstrip, Coplanar and Stripline Structures at Millimeter-Wave Frequencies

Registration

Register For This Event

When

6/20/17 11:00 am to 6/20/17 12:00 pm EST

Event Description

Technical Education Webinar Series

Title: Design Considerations and Tradeoffs for Microstrip, Coplanar and Stripline Structures at Millimeter-Wave Frequencies

Date: June 20, 2017

Time: 8am PT/ 11am ET

Sponsored by: Rogers Corporation

Presented by: John Coonrod, Technical Marketing Manager, Rogers Corporation, Advanced Connectivity Solutions

Overview:

RF technology using Printed Circuit Boards (PCBs) typically has several common basic structures which are manipulated to accommodate the intent of the design. Some common structures used for RF PCB applications are microstrip, coplanar and stripline circuit configurations. These structures are often used in multilayer PCB designs and each has its own set of capabilities and limitations.

Designing 5G structures? This webinar will give an overview of each structure and will investigate the many tradeoffs associated with choosing the proper structure for generic RF applications at various frequencies. The RF performance comparisons will be across a wide range of frequencies, from sub-microwave up to lower millimeter-wave frequencies such as 110 GHz. An outline of the webinar follows:

  • Elementary transmission line theory
  • Basic structure overview
  • Microstrip
  • Coplanar
  • Stripline
  • Structure comparisons across a wide range of frequencies
  • PCB variables to consider that affect RF performance (e.g. Etching tolerances and plated finish)

 

Presenter Bio:

John Coonrod is a Technical Marketing Manager for Rogers Corporation, Advanced Connectivity Solutions. John has been involved with the Printed Circuit Board industry for over 28 years. The initial 11 years was spent in the Flexible Printed Circuit Board industry responsible for circuit design, applications, processing and materials engineering. Following this experience, John supported the High Frequency Rigid Printed Circuit Board materials made by Rogers in regards to circuit fabrication, application support and electrical characterization studies of these materials. John is the Vice Chair on the IPC D24C High Frequency Task Group and holds a degree from Arizona State University in Bachelor of Science, Electrical Engineering.