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Technical Education Webinar Series
Title: PCB Material Selection for RF/Microwave/Millimeter-wave Design
Presented by: Mike Miller, Senior Manager of Military/Aerospace and Microwave Design Specialist
Sponsored by: Isola Group
Date: May 8, 2014
Time: 10am PT/ 1pm ET/ 5pm UTC
The PCB market for RF, microwave and millimeter-wave applications is evolving. What once was primarily focused on military applications has grown to meet the needs of commercial applications having demanding cost and performance requirements. This has resulted in an increase in PCB product offerings, presenting the designer with the challenge of choosing the right material.
Selecting the appropriate PCB material for RF, microwave and millimeter-wave applications require consideration of cost constraints and system-performance parameters, including:
In these systems, the PCB contributes to system loss through dielectric loss, conductor loss and impedance mismatch. Dielectric loss is determined by PCB material’s constituents, while conductor loss is due to copper surface roughness and skin effects. Impedance mismatch is a result of inconsistencies in PCB material thickness or constitutive parameters. Through careful considerations of the system performance constraints and PCB material attributes, an appropriate choice can be made.
This webinar will describe various PCB material attributes and the material selection process, as it relates to advanced automotive safety systems.
Why this webcast is important:
This webinar describes PCB material parameters, their effect on system performance and the process for product selection. At the conclusion of the web seminar, the viewer should have a better understanding of PCB material selection for RF/microwave/millimeter-wave systems, a fundamental part of the system design and development process.
Mike Miller is the Senior Manager of Military/Aerospace and Microwave Design Specialist for the OEM marketing team at Isola Group. Mike has more than 25 years of experience in RF/microwave and electromagnetics, having held senior engineering positions at General Atomics, ANSYS, Boeing, Northrop-Grumman and Lockheed-Martin. His career has focused on antenna and radome design, the design, simulation and application of engineered EM materials, and RF subsystems and channels. Mike has specialized in the application of computational electromagnetic tools. He has co-authored seven patents in antennas and electromagnetically tailored materials. Mike holds a MSEE degree from Arizona State University, he is an active participant in the Electromagnetic Code Consortium and currently a member of NDIA and IEEE.
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