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DPC 2014

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3/10/14 to 3/13/14
Radisson Fort McDowell Resort and Casino
Fountain Hills, AZ
United States

2014 Conference Overview:

The 10th Annual Device Packaging Conference (DPC 2014) will be held in Fountain Hills, Arizona, March 10-13, 2014. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Featuring Topical Workshop Tracks on:

  • Advanced 3D Packaging
  • Flip Chip and Wafer Level Packaging
  • Packaging Innovations & System Challenges for: Microsystems & Devices; Photonics Packaging

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