- Buyers Guide
Title: Simulating Dielectric and Conductor Loss Components Including the Influence of Trace Edge and Surface Roughness Topography
Date: November 26, 2013
Time: 8am PT, 11am ET, 5pm CET
Presenter: Tracey Vincent, Application Engineer, CST of America
The drive toward increased integration densities of electronic devices has led to smaller transmission line conductor sizes and structures consisting of multiple lossy dielectrics. At the same time, higher bit-rates of 100 GBits/s, has led to increased loss due to skin-effects. Losses in these types of transmission lines are often difficult to predict due to non-ideal transmission line cross-sections, including surface roughness and edge-shape effects.
To develop realistic simulated insertion loss, all insertion loss components need to be considered and accounted for. Dielectric and conductor loss components require careful material parameterization and structure set up. This webinar will give an overview of these parameterizations and set up, including the trace cross-section shape influence on conductor loss, an often overlooked phenomenon. Options for including surface roughness contribution to conductor loss, for both full wave 3D and analytical models, will be explored.
Tracey Vincentis an Application Engineer with the CST of America team, Framingham, MA. She has a combined Bachelors/Masters Degree in Electrical and Electronic Engineering from Herriot-Watt University in Edinburgh, Scotland. She also completed a Masters degree at Napier University, Scotland UK, where she wrote an FEA program to solve fields in ferrimagnetic materials. Tracey has ten years experience in designing circulators, combiners, power amplifiers, transitions, thick-film components, and filters. She recently completed her Ph.D. at WPI in Worcester, MA, where she investigated the effect of material topography on RF signal loss.
*As the CST webinar service provider does not support access via mobile devices, please ensure you use a desktop or laptop computer to register and attend the event.