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5G and IoT Supplement
Technical Education Webinar Series
RF PCB Design
Date & Time:
August 20, 2013; 8 AM PT/ 11 AM ET/ 3 PM UTC
One of the most demanding consumer products in the market is the wireless telecommunication product. A well-designed Radio Frequency Printed Circuit Board (RF PCB) contributes significantly to the success of any wireless product as the layout of the PCB greatly affects the performance, stability and reliability of the product. In today’s highly competitive wireless product market with increasingly compressed development time-frame, there is a strong demand for design professionals who possess the knowledge and experience to design top-performing RF PCBs in less number of iterations. This webinar offers participants an insightful knowledge on practical RF PCB design to bring your level of competence to the required standard to meet such demand. Practical design techniques on products in the market will also be highlighted.
Henry Lau, Lexiwave Technology
Henry Lau received his M.Sc. and MBA degrees from the UK and USA respectively. He has more than 22 years of experience in designing RF systems, products and RFICs in both Hong Kong and the US. He worked for Motorola and Conexant in the US as Principal Engineer on developing RFICs for cellular phone and silicon tuner applications. Mr. Lau holds five patents in RF designs. He is currently running Lexiwave Technology, a fabless semiconductor company in Hong Kong and the US designing and selling RFICs, RF modules and RF solutions. He has also been teaching numerous RF-related courses internationally.
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