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Contact Information

Phone: (480) 961-1382
Fax: (480) 961-4533

Location

Rogers Corp.
100 S. Roosevelt Avenue
Chandler AZ 85226
United States

Rogers Advanced Connectivity Solutions manufactures quality, high performance laminates. With manufacturing locations in the United States, Belgium and China, we supply proven laminate solutions for high frequency applications in the wireless base station, defense/aerospace, automotive, high-speed digital and advanced chip packaging markets across the globe. We take pride in our innovation to meet the evolving expectations of the electronics industry.

Articles

Rogers Corp. to Exhibit Advanced Circuit and Thermal Management Materials at DesignCon 2017

Rogers Corp.'s Advanced Connectivity Solutions (ACS) will feature examples of its high-performance circuit and thermal management materials for the most demanding electronic designs and working environments at DesignCon 2017, January 31-February 2, 2017 (exhibition from February 1-2, 2017) in the Santa Clara Convention Center (Santa Clara, CA). DesignCon is a premiere event for electronic design engineers working on circuit and system levels.


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Rogers Corp. Launches Cost-Effective Laminates for Automotive Radar Sensor Applications

Rogers Corp. announced the latest addition to its RO4000® Series thermoset circuit materials: RO4830™ high-frequency laminates. RO4830 laminates offer 76 to 81 GHz auto radar sensor designers a lower-cost-but-performance-competitive option. Rogers RO4830 laminates have a lower price point and are processed by means of standard epoxy/glass (FR-4) circuit fabrication methods, for lower overall production costs versus PTFE-based circuits.


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Rogers Corp. to exhibit high-performance circuit materials at PCB West 2016 Conference & Exhibition

Rogers Corp. will bring its materials expertise to PCB West on September 14 at the Santa Clara Convention Center (Santa Clara, CA), booth 201. Rogers will exhibit its high-performance circuit materials in addition to supporting a technical symposium for printed-circuit-board (PCB) users and designers with a presentation on the effects of conductor metal surface roughness on high-frequency PCB performance. 


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Rogers Corp. introduces 92ML thermally enhanced laminates and prepregs

Rogers Corp. is pleased to introduce 92ML™ materials. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. These materials are ideal for multilayer applications requiring thermal management throughout the entire board.


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Rogers' PES Group to show data matrix code capabilities at PCIM Europe 2016

Rogers Corp.’s Power Electronics Solutions (PES) group will be explaining and offering examples of its extended capabilities in applying data matrix codes for its various material-based product solutions at the upcoming PCIM Europe 2016 conference and exhibition. PCIM Europe 2016, one of the top global technical conferences and exhibitions for power electronics technology, is scheduled for May 10-12, 2016 at the Nuremberg Exhibition Centre, Nuremberg, Germany.


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Rogers' PES introduces new curamik CoolPerformance Plus coolers

Rogers Corp.’s Power Electronics Solutions (PES) group has introduced its latest high-performance cooling material, curamik® CoolPerformance Plus. curamik CoolPerformance Plus is an advanced liquid-cooled material designed to dissipate large amounts of heat and provide reliable thermal management of high-power laser diodes and other heat-generating optical devices.


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Rogers Corp. to showcase advanced connectivity material solutions at IPC APEX EXPO 2016

Rogers Corp. will be exhibiting at the upcoming IPC APEX Expo scheduled for March 15-17 at the Las Vegas Convention Center, Las Vegas, Nev. Representatives from Rogers Corp. will be exhibiting at Booth #607, providing information and insight on the use of their circuit materials, including ULTRALAM® 3850HT, CLTE-XT™, TC350™ RO3003™ and XT/duroid® laminates. Rogers will also be previewing its new material system developed for extremely low loss digital applications.


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Rogers Corp. to exhibit and educate at DesignCon 2016

Rogers Corp. will be exhibiting and educating at the upcoming DesignCon show. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center in Santa Clara, Calif.


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Rogers Corp. to offer practical material solutions at PCB West 2015

Rogers Corp. will be at PCB West, one of the electronic industry’s major technical events, on September 16, 2015 at the Santa Clara Convention Center (Santa Clara, CA). Rogers will provide examples of its high-performance printed-circuit-board (PCB) materials and participate in the technical symposium with a talk on how to perform wideband testing of PCBs with plated finishes. 


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Rogers Corp. signs definitive agreement to acquire Arlon, LLC

Rogers Corp., a global leader in engineered materials solutions, announced it has signed a definitive agreement to acquire Arlon, LLC, currently owned by Handy & Harman Ltd., for $157 million, subject to closing and post-closing adjustments. The transaction, which is subject to regulatory clearances, is expected to close in the first half of 2015. 


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Rogers Corp. releases video on innovation center opening

Rogers Corp. held a ribbon-cutting ceremony to dedicate the company’s new Innovation Center in Burlington, Massachusetts on March 25. More than 125 government officials, community leaders, technology company representatives and other guests were on hand to celebrate and tour the Center, which is located within Northeastern University’s George J. Kostas Research Institute for Homeland Security.


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Rogers highlights latest circuit materials & PCB techniques at IPC APEX EXPO

Rogers Corp. will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, being held March 25-27, 2014 at the Mandalay Bay Resort & Convention Center (Las Vegas, NV). The IPC APEX EXPO, with more than 400 exhibiting companies and thousands of attendees, is a leading industry event for professionals involved in PCB design and manufacturing and electronic assembly and test.


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Rogers highlights materials high performance circuits at DesignCon 2014

Rogers Corp. will be promoting its high performance printed-circuit-board (PCB) materials at the DesignCon® 2014 expo. The event is being held January 29-30, 2014 at the Santa Clara Convention Center (Santa Clara, CA). The DesignCon 2014 Expo provides practical solutions for semiconductor and electronic design engineers from more than 150 of the top suppliers in the electronic industry.


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Rogers shows advanced circuit material solutions and offers design guidance at IMS 2013

Rogers Corp. will highlight several of its high quality printed circuit board (PCB) materialsat the upcoming 2013 IEEE International Microwave Symposium (IMS).  Rogers’ Advanced Circuit Materials representatives will be on hand at exhibition booth #1459. In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from Phase Measurements.” as part of the technical program.


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Rogers to show high-performance laminates and bondply materials at electronica 2012

Rogers Corp. will be exhibiting several of its high-performance circuit materials at the upcoming electronica 2012 trade show. Scheduled for November 13-16, 2012 at the New Munich Trade Fair Centre, Munich, Germany, the 25th international electronica trade show (www.electronica.de) is a major electronics event for a wide range of business sectors, including automotive, medical, consumer, commercial, military and general wireless markets. The electronics trade show attracts press coverage from 22 countries and more than 500 technical publications.


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Rogers to showcase high performance printed circuit board materials at EuMW 2012

Rogers Corp. will be exhibiting at the 2012 European Microwave Week on October 29 through the 31st, at the Amsterdam RAI Exhibition and Convention Centre (Amsterdam, The Netherlands). European Microwave Week (www.eumweek.com) consists of three major conferences — the European Microwave Conference (EuMC), the European Microwave Integrated Circuits Conference (EuMIC), and the European Radar Conference (EuRAD), as well as a three day exhibition from October 29-31, 2012.


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Rogers employees sponsoring Harvest for Hunger to benefit local hunger programs

Families in Northeastern Connecticut are gearing up for a fun day of activities to help combat hunger by attending the first annual Harvest for Hunger event, Sunday, October 14, at Fort Hill Farms in Thompson, CT. Sponsored by the employees of Rogers Corp. and Fort Hill Farms, the event will be held from 11 a.m. to 5 p.m. A variety of fund-raising activities at the event will benefit Connecticut Food Bank’s mobile pantry and food programs of Thompson Ecumenical Empowerment Group (TEEG).


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Rogers welcomes PCB West 2012 visitors with product news and design/manufacturing guidance

Rogers Corp. will be participating in the PCB West 2012 Conference & Exhibition in both the technical program and the exhibition floor. The PCB West 2012 Conference & Exhibition (www.pcbwest.com) features a three-day technical conference (September 25-27) and one-day exhibition hall (September 26). Rogers Corporation (www.rogerscorp.com) welcomes visitors to join them for the PCB West 2012 Conference & Exhibition to learn more about the practical use of its high performance PCB materials.


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Rogers to highlight trio of antenna circuit materials at Mobile Antenna Systems 2012

Rogers Corp. will be displaying three of its leading high-performance circuit materials for mobile and fixed-site antennas at the upcoming Mobile Antenna Systems 2012 conference and exhibition. This key event for designers and specifiers of antennas for a wide range of fixed and mobile applications is scheduled for September 18-19, 2012 at the Hyatt Denver Tech Center (Denver, CO).


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Rogers appoints new president of Asia region

Rogers Corp. announced the appointment of Helen Zhang as President of Asia Region to oversee the company’s growing business in Greater China and throughout the Asia-Pacific region. Zhang will be responsible for driving Rogers’ growth strategy in Asia across the company’s three core businesses of printed circuit materials, power electronics solutions and high performance foams. 


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Rogers Corp. to display laminate solutions at DMEDS

Rogers Corp. will be offering a wide range of its high performance circuit board materials at the upcoming Del Mar Electronics & Design Show on May 2-3, 2012 at the Del Mar Fairgrounds in San Diego, CA. Representatives from Rogers Advanced Circuit Materials Division will be available at Booth #622 to help visitors obtain optimum performance using the company’s many different circuit board material offerings.


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Rogers combines DesignCon presentation with products

Rogers Corp. exhibited and presented a white paper concerning thermal conductivity at the DesignCon 2012 conference and exhibition. DesignCon, held January 31 through February 1, 2012, at the Santa Clara Convention Center, Santa Clara, Calif., is one of the electronic industry’s key meeting places for printed-circuit-board (PCB) designers.
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Rogers Names New President, CEO

Rogers Corp. announced that its Board of Directors has elected a new President and Chief Executive Officer, Bruce D. Hoechner, effective October 3, 2011, at which time he will also become a member of the company’s Board of Directors. Hoechner, 51, will succeed Robert D. Wachob, 64, who will...
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Rogers Offers Circuit Materials, Design Guidance

Representatives from Rogers Corp.'s Advanced Circuit Materials Division (ACMD) will be on hand at IMS 2011 to share insights on the optimum use of the company’s high performance circuit materials, including its RT/duroid® 6035HTC and RO4360™ laminates. Members of Rogers ACMD will be on hand at Booth 2515 to...
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Products

Thermoset Circuit - High-Frequency Laminates: RO4830

rogers-laminate_automotiveRogers Corp. announced an addition to its RO4000® Series thermoset circuit materials: RO4830™ high-frequency laminates. RO4830 laminates offer 76 to 81 GHz auto radar sensor designers a lower-cost-but-performance-competitive option. Rogers RO4830 laminates have a lower price point and are processed by means of standard epoxy/glass (FR-4) circuit fabrication methods, for lower overall production costs versus PTFE-based circuits.


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UL 94 V-0 Antenna-Grade Laminates: RO4730G3™

RO4730G3™Rogers Corp. introduces RO4730G3™ UL 94 V-0 antenna-grade laminates to meet present and future performance requirements in active antenna arrays and small cells, notably in 4G base transceiver stations (BTS) and Internet of Things (IoT) applications as well as emerging 5G wireless systems.These flame-retardant (per UL 94V-0), thermoset laminate materials are an extension of Rogers’ dependable RO4000® circuit materials.


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92ML™ Materials

rogers-92ML Rogers Corp. is pleased to introduce 92ML™ materials. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics.


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PCB Materials: RO4835™ and RO4360G2™

RO4835â?¢ and RO4360G2â?¢Rogers RO4835 high frequency laminates, specially formulated with improved oxidation resistance, were developed for applications needing improved stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. RO4360G2 laminates have a tailored high Dk of 6.15 at 10 GHz, which allows next generation power amplifier designers to meet size and cost reduction targets


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Liquid-Crystal-Polymer Laminates: ULTRALAM 3850HT

Rogers Corp. unveiled its ULTRALAM® 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, ULTRALAM 3850HT circuit materials are adhesiveless laminates that use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications.


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RO3003™ Laminates

RO3003(TM) Laminates

Rogers’ rolled copper cladding options, including the RO3003™ high frequency circuit material, are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. RO3003 has excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GHz.


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Thermally / Electrically Conductive Adhesive (TECA) Film

TECA FilmRogers Corp. advanced circuit materials division launched COOLSPAN® thermally & electrically conductive adhesive (TECA) film providing reliable high temperature performance. COOLSPAN TECA film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings.


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Antenna Grade Laminates: RO4700JXR(TM) Series

RO4700JXRseries

Rogers’ improved high frequency materials address several market needs. The improved RO4700JXR™ Series antenna grade laminates were designed for use in base station, RFID and other antenna designs and combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss.


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New PORON Dura-Shape Option

RogersDuraShape_100Rogers Corporation has achieved another technical first with its product line of PORON® urethanes. This unique PORON material enhancement, the Dura-Shape™ option, is a layer of polyester sealed between two layers of PORON foam which will help fabricators produce highly accurate gaskets. This new product is the solution that fabricators have been seeking in terms of improved die cutting for high performance gaskets and seals.


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RT/duroid® 5880LZ Laminates

RTduroid5880LZRT/duroid® 5880LZ materials have the lowest Dk for a copper clad laminate available in the market today. Because of its low dielectric constant of 1.96 at 10 GHz, RT/duroid 5880LZ supports broadband applications at the microwave through millimeter-wave frequencies where dispersion and circuit losses must be minimized. It is a lightweight, PTFE-based composite optimized with a unique filler that provides very low density (1.37 gm/cm3).


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Rogers D392A EL Lamp Driver IC

LampDriverThe Durel Division of Rogers Corporation has announced an addition to its high-performance electroluminescent (EL) lamp driver integrated circuits (ICs) - D392A. The D392A EL lamp driver delivers the programmable output voltages needed to power a wide range of EL lamps, including in portable applications such as cellular telephones, data organizers and PDAs, remote controls, monochrome LCDs, and DFLX™ EL keypad lamps.


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RO4730™ LOPRO™ Laminates

RO4730LOPROThe Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced RO4730™ LoPro™ laminates for base station, RFID and other antenna designs. RO4730 LoPro laminate materials combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss.


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RO4360 Laminates

RO4360LaminatesThe Advanced Circuit Materials (ACM) Division of Rogers Corporation has introduced RO4360™ laminates, developed for the special requirements of high-frequency amplifier designers. RO4360 laminates feature a dielectric constant of 6.15 and loss of 0.003 at 2.5 GHz. The laminates are based on a ceramic-filled, thermoset resin system reinforced by glass fiber for excellent mechanical stability compared to PTFE woven glass.


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RO3730™ Laminate Materials

R03730LaminateThe Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced its RO3730™ laminates, tailored for the special needs of high-frequency antenna designers requiring cost-effective PTFE laminates. These ceramic-filled laminate materials are reinforced by woven fiber glass with optimized glass and filler loading for excellent structural stability and outstanding electrical performance.


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Theta™ Printed Circuit Materials

ThetaPRRogers Corporation will feature a variety of its advanced materials solutions for the electronic design and semiconductor industries at DesignCon 2010 in Santa Clara, CA,  including Theta™ printed circuit materials, ULTRALAM® 3000 laminates, RO2808™ laminates, and RO4000® LoPro™ circuit board materials.Theta laminates and prepregs are environmentally friendly, high-performance FR-4 materials compatible with lead-free assembly processing.


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PORON® ThinStik™ Materials

ThinStikMore cushioning and sealing, less wasted space, enables thinner designs. As handheld devices decrease in size and increase in functionality, achieving the proper balance of sealing and protection with the requirements of an ultra thin application can be an extreme design challenge. To help address this need, Rogers Corporation has specifically engineered the PORON ThinStik family of self-adhesive solutions.


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ULTRALAM® 3000/RO2808™/RO4000®

UltralamRogers Advanced Circuit Materials (ACM) Division employees will be at IMAPS Device Packaging 2010, offering information on ULTRALAM® 3000 laminates, RO2808™ laminates, and RO4000® circuit board materials, including the recently launched RO4360™ laminate (6.15 Dk), which many in the field believe is a very effective cost-down replacement for LTCC (low temperature co-fired ceramic) packaging designs.


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RO4360 High Frequency Laminates

RO4360HFlaminatesRogers has launched the groundbreaking RO4360 high frequency laminates, the latest addition to the RO4000® product family. RO4360 thermoset laminate materials are specially formulated to meet a Dk of 6.15 and exhibit a low dissipation factor of 0.0038 at 10 GHz. RO4360 laminates possess a Z-axis coefficient of thermal expansion of 30 ppm/°C (CTE) for dependable plated-through-hole (PTH) quality in multilayer circuit and package designs.


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RO4460™ Prepreg and RO4360™ Laminates

4460prepregRogers Corporation has developed the perfect prepreg match to its popular RO4360™ laminates: RO4460™ prepregs. Both materials feature consistent dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer amplifiers, antennas, and other high-frequency circuits where space is at a premium.


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RT/Duroid 6035HTC Laminate

6035HTCRogers Corp.'s RT/duroid® 6035HTC is a high-thermal-conductivity (HTC) laminate material engineered for low loss in high power circuits. The fluoropolymer composite material is ideal for RF and microwave applications in military and high reliability (hi-rel) applications required to handle high power levels, such as power amplifiers. Rogers RT/duroid 6035HTC laminates feature a relative dielectric constant of 3.5 at 10 GHz.


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PowerCircuit™ Busbars

Busbar

Rogers Corp.'s Power Distribution Systems Division has an innovative new solution for emerging power electronics applications: RO-LINX® PowerCircuit™ busbars. The PowerCircuit solution was developed to meet the growing power distribution demands in electric vehicle (EV) drives, hybrid electric vehicle (HEV) drives and related charging systems.


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Events

Webinars

Measurement of PIM Distortion in Microstrip Transmission Lines

3/26/15

Rogers Corp.
Technical Education Webinar Series

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Webinars

Microwave and mmWave Circuit Material Performance

9/29/15


Technical Education Webinar Series

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Downloads

Rogers Durable Electronics & Lighting Solutions

This brochure provides a detailed overview of Rogers comprehensive capabilities in screen-printed electronics and associated services, gained from over 20 years of design and high volume manufacturing experience in printed electronics, low power EL backlighting systems and EL driver ICs.

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BISCO Silicone Materials

A new 16-page Material Selection Guide for its BISCO Silicone material. These materials, which are offered in cellular, solid and specialty grades, are used in a wide range of markets, from transportation and communications to electronics and high intensity lighting. Applications include gaskets and seals, high temperature PCB thermal insulation and battery shields, automotive heat shields, and vibration and acoustic mitigation pads.

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High Frequency Laminates

Product Selector Guide

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RFQ

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