EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C.

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. 

Master Bond MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material.

EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. It offers electrical conductivity with a volume resistivity of 5-15 ohm-cm and a thermal conductivity of 2.88-3.46 W/(m•K) at room temperature.

Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”. 

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). 

Master Bond MasterSil 153AO is an addition cured two part silicone with a self priming property. It has a high tensile lap shear strength, especially for a silicone. 

Supreme 17HT possesses high bond strength properties with lap shear strength of 1,900 to 2,100 psi and tensile strength of 7,000 to 8,000 psi. 

Master Bond Supreme 3CCM-85 is a single component epoxy initially designed primarily for glob top and chip coating applications.

Master Bond MasterSil 151S is a two part, electrically conductive silicone. This silver filled, highly flexible system can be used for low stress applications.  

EP62-1AO is a two part epoxy adhesive and sealant with an exceptionally long working life of 12-14 hours at ambient temperature for a 100 gram mass.

EP41S-6 is a two component epoxy system that meets UL 1203. EP41S-6 can be used in potentially explosive environments.

Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature.

EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10^-6 K•m²/W.

Master Bond EP17HTS-DA is a one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures.

3HTS-80 is a one part, silver filled epoxy adhesive that is not premixed and frozen and features an unlimited working life at room temperature.

EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system.

Master Bond EP3UF-1 is a single component epoxy that is not premixed and frozen. It delivers high bond strength and dimensional stability. 

Master Bond EP70CN is a two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This epoxy system forms high physical strength bonds and can be utilized for bonding, sealing, coating and potting.

Master Bond EP30NS is a two component epoxy system. It is optically clear and offers dimensional stability andlinear shrinkage of less than 0.01%.

Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications.

Featuring a silver coated nickel filler, MB600SCN is an aqueous based, sodium silicate system for use in applications where very good shielding effectiveness is required and cost considerations might be more pronounced. Conductive coatings are often applied to housings in order to protect electronic devices from EMI and RFI.

Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10^-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. EP13LTE cures readily in 1-2 hours at 300 to 350°F. This epoxy paste has limited flow while curing. It bonds well to many substrates such as metals, glass, composites, ceramics and plastics.

Master Bond EP29LPHE is a two component epoxy system with a low mixed viscosity of 350 to 700 cps. This low shrinkage/low exotherm product is particularly well suited for large volume casting applications as well as bonding, coating and sealing. EP29LPHE has a forgiving 100 to 80 mix ratio by weight and has an exceptionally long working life of 12 to 24 hours at room temperature for a 100 gram batch. It will cure at room temperature or more rapidly at elevated temperatures.

Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable epoxy has formidable bond strength, particularly in the shear mode, ranging from 3,400-3,600 psi. Its service temperature range extends from 4K to +260°C. 

Featuring a low viscosity, EP38CL is an optically clear two component epoxy that is used for bonding, sealing, coating and encapsulation in optical, aerospace, opto-electronic and specialty OEM applications. It possesses superior impact resistance, thermal cycling capabilities as well as the ability to withstand mechanical shock better than typical epoxies that are higher on the Shore D scale. 

Specially formulated, two part epoxy EP48TC has ultra low thermal resistance of 5 to 7 x 10 to 6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as 10-15 microns. It also features unmatched thermal conductivity of 20-25 BTU•in/ft2•hr•°F [2.88-3.60 W/(m•K)]. EP48TC has first rate electrical insulation properties over the wide service temperature range from -100°F to +300°F. 

With exceptional thermal conductivity and electrical insulation properties, EP46HT-1AO is a two component epoxy for high performance bonding and sealing applications. This high temperature resistant system cures readily with heat and offers a long open time at room temperatures. It provides noteworthy dimensional stability, chemical resistance and physical strength properties. 

Master Bond’s epoxy EP79FL is a silver coated nickel filled polymer system that forms high strength bonds even at extreme cryogenic temperatures. It is electrically conductive and has minimal sagging while maintaining thermal cycling resistance. EP79FL is a strong and flexible system with exceptional chemical resistance properties. The electronic, electric, computer, semiconductor, microwave, appliance and automotive industries use it extensively. 

One component Master Bond MasterSil 711 is a room temperature curing silicone compound for bonding, sealing, coatings and formed-in-place gaskets. It offers superior shock and impact resistance making it ideal for delicate electronic components. Flexible bonds are formed when exposed to atmospheric moisture. MasterSil 711 requires no mixing or heat, and sets within 2-3 minutes. 

Well suited for die attach applications, Supreme 3HTND-2DA is a single component fast setting epoxy that doesn’t require mixing or freezing. This toughened system has high die shear strength, superior electrical insulation properties, low ionics, an ideal dispensing profile (no tailing or bleed out) and performs well in 85/85 testing. It also passes NASA low outgassing tests. 

Suitable for large castings, EP21LVSP6 is a room temperature curing system with a long open time and a low viscosity. This epoxy features a convenient one to one mix ratio and can also be used in bonding, sealing and coating applications. It has very good physical strength properties as well as being an excellent electrical insulator. 

Master Bond MB600S is an aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required.Tested according to IEEE 299, 2006 methods, MB600S was as effective as the aluminum reference with a shielding effectiveness of 95 to105 dB, from 1 to 2 GHz.

Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are widely used for shielding and static dissipation applications because of their balance of shielding effectiveness and cost effectiveness.