Intercept Technology Inc., a leading provider of PCB, RF, Hybrid, and high-speed design software, celebrates the close of its 30th year of EDA software solutions development with discounts of up to 75% off on all its software.
Intercept Technology Inc. announces its newest authorized reseller, Fusion CADSoft LLC. As an experienced EDA software reseller in the Eastern United States, Fusion CADSoft aims to supply Intercept’s PCB, RF, and Hybrid design and engineering software in the regions from Maine to Florida, and Minnesota to New Jersey.
Intercept Technology Inc., a leading provider of PCB, RF, Hybrid, and high-speed CAD/CAE design software, has joined the ODB++ Solutions Alliance as a demonstration of its continued support for unified CAD/CAM vendor file formats. For over 15 years, Intercept’s Pantheon PCB layout software has offered a variety of manufacturing file formats for its user base, and Intercept remains committed to continuing to support both legacy and new file formats.
Intercept Technology Inc., a leader in EDA engineering and layout applications, announces a major new enhancement release of its Pantheon PCB layout software, which includes specialized RF and Hybrid design flows. Following version 7's award-winning debut*, Intercept continues to make great strides forward with its latest version, 7.0_02C.
Intercept Technology Inc., a leading provider of PCB, RF, Hybrid, and high-speed design software solutions in the EDA industry, is the recipient of the 2012 New Product Introduction (NPI) Award from Printed Circuit Design & Fab Magazine in the PCB Design Tools category.
Intercept Technology Inc. , a leader in PCB/Hybrid/RF electrical engineering applications, announced the availability of its next major software release, Pantheon 7BETA. A monumental departure from its former version, the new Pantheon includes a completely redesigned user interface with significant performance and productivity increases across the entire design team...
Intercept Technology Inc. , a leader in PCB/Hybrid/RF electrical engineering applications, announced an enhanced bidirectional link between Intercept’s Mozaix schematic and Pantheon layout design applications and AWR Corp. ’s Microwave Office software. This bidirectional capability couples Intercept’s Mozaix schematic, with full RF model and layout information imported and pushed...
Intercept Technology’s award-winning Pantheon PCB layout software with specialized RF and Hybrid user flows is now more affordable than ever. Integrated with a full CAD/CAE environment flow, Pantheon includes bidirectional RF simulation interfaces to Ansys DesignerRF™, Ansys HFSS™ and AWR Microwave Office™, RF models, reuse blocks, multi-board capabilities, panel arrays, artwork panelization,and more.
The Intercept Technology RF Design flow includes Pantheon™ layout software with specialized RF design options, and bidirectional simulation interfaces to Ansys DesignerRF™, Ansys HFSS™ and AWR Microwave Office™. Vendor-specific RF models can be defined parametrically and placed in the layout, maintaining the simulation stream one-for-one.
Intercept’s specialized RF design flow with AWR allows engineers or designers to begin a design in AWR’s Microwave Office™, Pantheon™ layout software, or Mozaix™ schematic software. This flexibility is made possible by Intercept’s ability to send data to and from AWR’s Microwave Office bidirectionally, allowing designers and engineers to maintain closer communication during the design cycle.
With Intercept’s Pantheon layout software, RF design is made easy with its flexible shape and fill creation and management, detailed stackup builder, 3D viewer, and automated via handling. Modeling with HFSS is as easy as “cutting” a section of a design from the layout and sending it to HFSS for simulation.
Intercept Technology Inc.® announces that development is under way for 3-dimensional design in Pantheon. The 3D environment will be directly embedded into the main software drawing routines so that all aspects of layout design can be accomplished in a three dimensional view. The 3D environment will empower designers to place, route, and make design edits directly in the 3-dimensional view.
By utilizing a more sophisticated method of data transfer directly to and from the RF simulation application, design cycle time can be greatly reduced while also increasing the integrity of the resulting board design.