Pat Hindle, MWJ Editor
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Pat Hindle is responsible for editorial content, article review and special industry reporting for Microwave Journal magazine and its web site in addition to social media and special digital projects. Prior to joining the Journal, Mr. Hindle held various technical and marketing positions throughout New England, including Marketing Communications Manager at M/A-COM (Tyco Electronics), Product/QA Manager at Alpha Industries (Skyworks), Program Manager at Raytheon and Project Manager/Quality Engineer at MIT. Mr. Hindle graduated from Northeastern University - Graduate School of Business Administration and holds a BS degree from Cornell University in Materials Science Engineering.

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Infineon, Triquint Winners in iPhone 3G

July 15, 2008

Patrick Hindle

1 Comment

Well, it took no time at all for someone to crack open the new iPhone 3G and see what chips are inside. iFixit.com got one in the first major time zone for it to go on sale (New Zealand) and dissected it immediately (http://live.ifixit.com/images/XiuvbfUecK3GsDUm-large.jpg). Infineon with 4 chips and Triquint with 3 chips were the clear winners here. Skyworks had one chip, a quad band amplifier module which I think they also had a similar part in the first generation iPhone. Triquint has 3 amplifier modules that include an input filter, linear amplifier, duplexer and coupler. Infineon has the GPS, digital baseband processor, UMTS transceiver and power management IC. This should be a good boost for Triquint and Infineon is already a major player in these areas but it will be good PR for them also.