Pat Hindle, MWJ Editor
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Hindle
Pat Hindle is responsible for editorial content, article review and special industry reporting for Microwave Journal magazine and its web site in addition to social media and special digital projects. Prior to joining the Journal, Mr. Hindle held various technical and marketing positions throughout New England, including Marketing Communications Manager at M/A-COM (Tyco Electronics), Product/QA Manager at Alpha Industries (Skyworks), Program Manager at Raytheon and Project Manager/Quality Engineer at MIT. Mr. Hindle graduated from Northeastern University - Graduate School of Business Administration and holds a BS degree from Cornell University in Materials Science Engineering.

WiFi is Pushing RF ICs to New Heights

September 9, 2009
Strategy Analytics states that vendors will ship $4 billion in Wi-Fi radio chips in 2013, most of these for cellphones, notebooks, netbooks, infrastructure, home entertainment systems and wireless gaming consoles. At the same time, adoption of 802.11n MIMO with multiple transmit streams will help boost the market for Wi-Fi power amplifier modules to twice its 2008 size, despite continued pricing pressure.

They have determined that Broadcom will probably remain on top, but the firm faces increasing competition from cellular chip vendors bundling connectivity with their platforms, and from chip specialists targeting emerging applications, such as Wi-Fi for home entertainment. In RF power amplifiers, SiGe Semiconductor has established a firm lead despite increasing competition from GaAs PA module specialists Skyworks, RFMD, TriQuint and Anadigics.

WiFi is becoming pervasive now and soon you won't be able to buy a phone, camera, printer, TV or PC that does not come with it. Remember when only the new and more expensive phones and PCs had cameras? Now you can hardly find them without one. That will be WiFi soon in consumer electronics.
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