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David Vye, MWJ Editor

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David Vye is responsible for Microwave Journal's editorial content, article review and special industry reporting. Prior to joining the Journal, Mr. Vye was a product-marketing manager with Ansoft Corporation, responsible for high frequency circuit/system design tools and technical marketing communications. He previously worked for Raytheon Research Division and Advanced Device Center as a Sr. Design Engineer, responsible for PHEMT, HBT and MESFET characterization and modeling as well as MMIC design and test. David also worked at M/A-COM's Advanced Semiconductor Operations developing automated test systems and active device modeling methods for GaAs FETs. He is a 1984 graduate of the University of Massachusetts at Dartmouth, with a concentration in microwave engineering.

EDI CON 2014 Conference Schedule

January 18, 2014
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Last week marked the deadline for final papers to be submitted to the peer-reviewed portion (technical sessions) of the Electronic Design Innovation conference(EDI CON)  coming this April in Beijing. This year's crop of papers is an excellent representation of the state of the industry in terms of systems being developed and the advances in technology that will support these systems. Radar, LTE-A, Navigation satellite, 802.11 and MIMO were among the recurring system topics submitted mostly by industry, while GaN, CMOS, SOI and SIW were among the popular technologies submitted for consideration. Overall, we added two specific modeling tracks (one for system-level and the other for EMC/High-Speed Digital) and an additional twelve hours of presentations to the first day in order to accommodate the increase in paper submissions over 2013.

The EDI CON organizers work is now in full swing as we finalize the conference schedule and group the content to best accommodate the specific interests of attending delegates and VIP guests. In the next few weeks we will be announcing details reagrding our opening plenary sessions (which will feature two sets of keynote talks), special expert panel sessions and other conference related activities. For now, here's a brief look at how the program is shaping up.

EDI CON 2014 Conference Schedule

Overview

EDI CON 2014:

3 Day peer-reviewed industry-focused technical conference

  • 86 peer reviewed papers
  • 30 workshops
  • 5 panel sessions
  • 1 Agilent Education forum
  • 8 keynote talks from Industry executives, leading researchers and academics

Technical Papers

Tracks

  • RF, Microwave and High-speed digital design
  • RF/mW measurement and modeling
  • EMC/EMI, High-speed digital measurements and modeling
  • System-level measurements and modeling
  • System engineering
  • Commercial resources

Sessions (2-4 papers per session)

Tuesday, April 8th

  • TU101 - Envelope Tracking
  • TU102 - Harmonic Load-pull Techniques
  • TU103 - Spectrum Management and Analysis
  • TU104 - Multiple Antenna Test

Wednesday, April 9th

  • WE101 - RF/MW/HSD Circuit Design I
  • WE102 - RF/MW Measurement/Modeling I
  • WE103 - MIMO OTA Testing
  • WE104 - Global Navigation and Communication Satellite Systems
  • WE105 - Materials and PCBs 
  • WE201 - Power Amplifier Design and Linearization techniques
  • WE202 - Device modeling for PA design and stability analysis
  • WE203 - E-band and mmW System-level measurements, planning and synthesis tools
  • WE204 - RADAR and LTE MIMO Systems
  • WE205 - Materials, PCBs and Interconnects

 Thursday, April 10th

  • TH101 - RF/mW passive component and antenna design
  • TH102 - Noise characterization techniques
  • TH103 - EMI, high-speed characterization and jitter analysis
  • TH104 - RADAR, Wide bandwidth systems, MIMO--OFDM and Phase Coherence
  • TH105 - MIMO wireless test and spatial channel modeling
  • TH201 - Antennas and antenna array design
  • TH202 - High power transistor characterization and thermal analysis
  • TH203 - Signal Integrity and gigabit channel measurements
  • TH204 - Radio planification, NFC, spectrum emission mask analysis and EMVCo testing
  • TH205 - Commercial resources 1

Panel sessions

  • GaN Panel

nsored by Richardson RFPD

  • MIMO OTA Test Panel

                 Sponsored Spirent Communications

  • EDA Design Flow Panel

  Featuring Agilent Technologies, AWR, ANSYS, CST

  • Aligning RF semiconductor technology to end-use applications

  Featuring OMMIC, Peregrine Semiconductor, WIN Semiconductor, Freescale

  • Trends in future telecommunications systems and their engineering challenges

                  Moderated by Guangyi Liu, Chief Research Scientist - China Mobile Research Institute

 

Plenary session

  • Junde Song, EDI CON 2014 Chair Emeritus – Welcome Remarks
  • ERPING LI, RF and Nanoelectronics Research Center, Zhejiang University
  • Keming Feng, Beijing Institute of Radio Metrology and Measurement
  • Message from Host  Sponsor, Agilent Technology
  • Corbet Rowell, China Mobile Research - 5G Cellular Challenges
  • Deng Jie , ZTE
  • Message from Corporate Sponsor, NI executive
  • Mr. Josef Wolf, Rohde & Schwarz

Full Program available at

EDI CON 2014 Conference Schedule

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