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Military Microwaves Supplement
Last week marked the deadline for final papers to be submitted to the peer-reviewed portion (technical sessions) of the Electronic Design Innovation conference(EDI CON) coming this April in Beijing. This year's crop of papers is an excellent representation of the state of the industry in terms of systems being developed and the advances in technology that will support these systems. Radar, LTE-A, Navigation satellite, 802.11 and MIMO were among the recurring system topics submitted mostly by industry, while GaN, CMOS, SOI and SIW were among the popular technologies submitted for consideration. Overall, we added two specific modeling tracks (one for system-level and the other for EMC/High-Speed Digital) and an additional twelve hours of presentations to the first day in order to accommodate the increase in paper submissions over 2013.
The EDI CON organizers work is now in full swing as we finalize the conference schedule and group the content to best accommodate the specific interests of attending delegates and VIP guests. In the next few weeks we will be announcing details reagrding our opening plenary sessions (which will feature two sets of keynote talks), special expert panel sessions and other conference related activities. For now, here's a brief look at how the program is shaping up.
EDI CON 2014:
3 Day peer-reviewed industry-focused technical conference
Sessions (2-4 papers per session)
Tuesday, April 8th
Wednesday, April 9th
Thursday, April 10th
nsored by Richardson RFPD
Sponsored Spirent Communications
Featuring Agilent Technologies, AWR, ANSYS, CST
Featuring OMMIC, Peregrine Semiconductor, WIN Semiconductor, Freescale
Moderated by Guangyi Liu, Chief Research Scientist - China Mobile Research Institute
Full Program available at
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