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David Vye, MWJ Editor

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David Vye is responsible for Microwave Journal's editorial content, article review and special industry reporting. Prior to joining the Journal, Mr. Vye was a product-marketing manager with Ansoft Corporation, responsible for high frequency circuit/system design tools and technical marketing communications. He previously worked for Raytheon Research Division and Advanced Device Center as a Sr. Design Engineer, responsible for PHEMT, HBT and MESFET characterization and modeling as well as MMIC design and test. David also worked at M/A-COM's Advanced Semiconductor Operations developing automated test systems and active device modeling methods for GaAs FETs. He is a 1984 graduate of the University of Massachusetts at Dartmouth, with a concentration in microwave engineering.

CS Mantech takes on the Big Easy

May 15, 2013
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CS ManTech 2013

CS ManTech is an independent not-for-profit organization whose mission is to promote technical discussion and scientific education in the compound semiconductor manufacturing industry. The 2013 CS ManTech program begins on Monday, May 13th with a series of tutorial workshops. Noted speakers will examine the many factors that are important to business and engineering aspects of the PA industry, including the customer motivation, the design, and major manufacturing processes that yield a finished, packaged die.

CS ManTech will also host the internationally-acclaimed ROCS (Reliability of Compound Semiconductors) Workshop which will provide an agenda that is packed with industry, government and university professionals and comprise the latest results of all phases of Compound Semiconductor Reliability (see http://www.jedec.org/home/gaas/ for details). This meeting is sponsored by the JEDEC JC-14.7 Committee on GaAs Reliability and Quality Standards and the EIA.

The organizers have arranged several events around the exhibition to encourage interaction between conference delegates and commercial solution providers populating the exhibition space. This first event is an exhibitor’s reception that took place on Monday evening between 6:00 and 9:00 pm. This reception allowed delegates and exhibitors to mingle on a more social level. The exhibition hours officially started the following day (Tuesday) and ran from 10:000 am to 5:30 PM and then again on Wednesday starting bright and early with the exhibitors’ breakfast from 7:00am to 8:30 am. The exhibit remained open until 11:00 am  on Wednesday.

The CS ManTech Conference formally opens on Tuesday morning with a brief overview of the conference and the awards presentation for the best papers from the 2012 conference and our most loyal sponsors. This is immediately followed by the two Opening Sessions of invited speakers which will cover overviews of the GaAs Industry and Photonics IC Industry from prominent CEOs and companies within the United States, Canada, Taiwan and Europe. The Tuesday technical session will conclude with both the Exhibitors’ Forum and Student Forum. The student forum provides an opportunity for students to explore career options through networking and interactions with members of the CS community in academia, industry, and government laboratories.

The Exhibitors' Forum provides achance for vendors to showcase their technical expertise while promoting company products at The 2013 International Conference on Compound Semiconductor Manufacturing Technology. A limited number of short demonstrations were scheduled for early afternoon on Tuesday. Here exhibitors have the opportunity to present their latest technologies and offerings in an informal and relaxed environment. The presentation can be educational (working on a solution for your product) or strictly commercial (highlighting features of the product). The CS ManTech exhibits are an excellent opportunity to view suppliers of materials, services and tools from around the globe. Approximately 65 vendors participated in this years event (see exhibitor list below).

The sessions on Wednesday morning will start early with breakfast in the Exhibition Center where attendees and vendors can continue to foster new relationships. The technical sessions start promptly thereafter in order to accommodate a full schedule of world-class technical topics. The two parallel sessions of Wednesday morning focus on extremely important topics like manufacturing, materials, process and test. Wednesday lunch will be open to explore the many opportunities for fine local fare in the French Quarter within walking distance from the hotel. The Wednesday afternoon program features two sessions that address modern advances in thermal design for high-power devices, a session on all things temporal and the all-important session on metals.  Wednesday evening brings the highly-anticipated Rump Sessions where deliberation and debate stir the soul of any ManTech attendee! We eat, drink and argue our case in the atmosphere of healthy competition. Attendees may join any or all of the four parallel topics, where moderators will encourage informal, lively, and highly-interactive discussions.

 

On Thursday morning, two parallel sessions will encompass optoelectronics, wide-bandgap power devices, III-nitride epitaxy and advances in process integration. The Thursday lunch will allow you to combine the taste of excellent food with networking and discussions around the table. Thursday afternoon will include our closing two sessions on yield enhancement in parallel with advanced gate dielectrics for GaN devices. A new format for the Interactive Forum will be introduced in 2013 where traditional poster papers will be presented. This poster session includes papers that were accepted especially for interactive presentation. Attendees will have the opportunity to meet with authors to discuss their papers in detail. Attendees of the Interactive Forum will vote for the best poster, and the winning author will receive the Best Poster Award. The celebratory Conference Closing Reception will follow the Poster Session.

 

 

Alphabetical listing of exhibitors

Accel-RF Instruments Corp - 227

MEI Wet Processing Systems & Services - 107

AIXTRON SE - 131

MicroChem Corp - 123

Albemarle Electronic Materials - 206

Momentive - 211

Ammono- 318

NANO-MASTER, Inc.- 326

Associated Material Processing - 201

Nanometrics - 214

AXT, INC. -312.

Nanotronics Imaging - 217

Brewer Science - 231

Oerlikon Leybold Vacuum/Oerlikon Systems- 216

C&D Semiconductor Services, Inc.- 328

Oxford instruments - 103

China Crystal Technologies Co., Ltd. - 324

Plasma-Therm - 230 & 232

Compound Semiconductor Magazine - 105

Proton Onsite - 226

Cree - 237

PVA TePla America Inc.- 208

CS CLEAN SYSTEMS - 212

Quantum Focus Instruments Corporation- 306

DOWA International Corporation - 308

Quik-Pak - 218

EpiWorks - 202

RIBER INC - 127

Evans Analytical Group - 119

SAFC Hitech - 228

EVATEC NA - 113

SAES Pure Gas- 224

Ferrotec USA- 215

SAMCO Inc. - 219

Final Phase Systems - 213

Semicat- 327

Freiberger USA - 332

Semiconductor Today- 229

Hitachi Cable Ltd- 203

Shin-Etsu MicroSi- 220

HUETTINGER Electronic, Inc. - 129

Soitec USA - 329

II-VI Incorporated : WBG Materials - 205

Solid State Equipment LLC- 200

INNOViON Corp- 325

SPTS Technologies - 304

Insaco, Inc. - 111

Sumika Electronic Materials, Inc - 223

Inspectrology - 311

Teikoku Taping System - 321

Intelligent Epitaxy Technology Inc. - 316

Trion Technology - 330

IQE - 236

Vacuum Engineering & Materials - 125

JST Manufacturing, Inc.- 320

Virginia Diodes Inc. -225

KITEC microelectronic technologie GmbH- 235

Visual Photonics Epitaxy Co., Ltd- 115

KLA-Tencor - 117

Wafer World Inc. - 204

Leighton Electronics - 314

YOLE DÉVELOPPEMENT - 207

   
 

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