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ARTICLES

Planar EM Simulation of Multi-chip Modules and BGA Packages

Effect of planar electromagnetic simulators on multi-chip modules and ball grid array mounting techniques
Jim DeLap
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Technical Feature Planar EM Simulation of Multi-chip Modules and BGA Packages Jim DeLap Agilent EEsof EDA Westlake Village, CA As electronics vendors and consumers demand smaller and lower cost products, manufacturers must find ways to increase levels of integration while maintaining product functionality. These higher levels of integration are...
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