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ARTICLES

High Power IC Package

StratEdge introduces laminate packages for high power devices

StratEdge Corp., a designer and producer of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, introduces a new family of high power laminate packages at IMS2012 Booth #1625. The LL family of leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).


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StratEdge Displays DC to 50+ GHz Packages

StratEdge , leader in the design and production of semiconductor packages for microwave, millimeter-wave and high speed digital devices, will display its high power, high performance, DC to 50+ GHz packages at the IEEE MTT 2010 International Microwave Symposium (MTT-S) booth #2021. StratEdge has an extensive catalog of standard...
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StratEdge Introduces High-frequency Surface-mount Package

StratEdge , a leader in the design and production of semiconductor packages for microwave, millimeter-wave and high speed digital devices, announces the release of its new high-frequency SMX Series surface-mount package. The new DC to 30 GHz package is designed for use in test and measurement, VSAT, point-to-point, point-to-multipoint,...
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A MMIC Power Amplifier Package for OC-192 Applications

A wideband, medium power amplifier with automatic gain control for use as an AGC or laser modulator driver amplifier in OC-192 fiber optic systems
PRODUCT FEATURE A MMIC Power Amplifier Package for OC-192 Applications StratEdge San Diego, CA StratEdge was contracted by TriQuint Semiconductor, a manufacturer of GaAs MMIC components, for package, assembly and test services for one of their newest devices. The resulting product, a wideband, medium power amplifier (MPA) with automatic...
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