advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

ARTICLES

Design Equations for Maximum Power Transfer in Back-to-back Stacked Microstrips

The design of noncontacting RF interconnections using a slot in the common ground plane for application in mulitlayered structures
K. Rambabu, M. Ramesh and A.T. Kalghatgi
No Comments
Technical Note Design Equations for Maximum Power Transfer in Back-to-back Stacked Microstrips K. Rambabu, M. Ramesh and A.T. Kalghatgi Please click here to view the pdf file of the Technical Note...
Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement