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ARTICLES

A Plastic Package for Custom Circuits

An injection-molded plastic packaging technique developed for small-signal, high-frequency circuits
October 1, 1998
A Plastic Package for Custom Circuits KDI/triangle Corp. Whippany, NJ Packaging has long been a key to reducing costs and speeding time to market for RF and microwave designs. Both commercial and military applications now call for small and lightweight high performance packages that do not add excessive cost....
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