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ARTICLES

An MCM BGA Platform for Commercial Systems Applications

The implementation of multichip module (MCM) ball grid array (BGA) packaging as a low cost platform for use in commercial systems applications
An MCM BGA Platform for Commercial Systems Applications This article describes the implementation of ball grid array (BGA) packaging as a low cost platform for use in commercial systems applications. The BGA platform is an efficient technique used for interconnecting semiconductor die to a substrate. The platform distributes RF...
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