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ARTICLES

Beyond the 1GHz Barrier with Thick-Film Ceramic

Using a ceramic multichip module to achieve high frequency performance beyond what is capable in a printed circuit board
November 1, 1997
Beyond the 1 GHz Barrier with Thick-film Ceramic Daniel I. Amey and Samuel J. Horowitz DuPont Electronic Materials Research Triangle Park, NC Stephen Sekel Tektronix Inc. Beaverton, OR Jeff Powell and Brian Durwood Maxtek Components Corp. Beaverton, OR Design challenges change at frequencies beyond 1 GHz. Circuits begin to...
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