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Articles by Cirexx International Inc.

Cirexx to present ECLIPS technology at IMS2015

Cirexx International announced that they will be presenting their ECLIPS technology at IMS2015 in Phoenix, Ariz., May 17-22. Cirexx will be in Booth # 2023. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave printed circuit boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics.


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Cirexx presents ECLIPS at IMS 2014

Cirexx International is presenting the new ECLIPS technology this week at the International Microwave Symposium (IMS) at the Tampa Convention Center.  ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF and microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized layer which has superior thermal conductivity characteristics.


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