The Economics of GaAs and CMOS PAs: Crunch Time
Design and Test Challenges for Next-Generation 802.11ac, ad WLAN Standards
CoMP: The Most Challenging Technology Component in LTE-Advanced 3GPP Release 11
EnSilica has partnered with Cross Border Technologies to accelerate the sales of both its IC design services and system IP solutions in key European and Asian markets, particularly Germany, France, Japan and Korea.
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