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Articles by Rogers Corp.

Rogers to highlight trio of antenna circuit materials at Mobile Antenna Systems 2012

Rogers Corp. will be displaying three of its leading high-performance circuit materials for mobile and fixed-site antennas at the upcoming Mobile Antenna Systems 2012 conference and exhibition. This key event for designers and specifiers of antennas for a wide range of fixed and mobile applications is scheduled for September 18-19, 2012 at the Hyatt Denver Tech Center (Denver, CO).


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Rogers to highlight material solutions spanning RF to digital at the 2012 IPC Midwest Show

Rogers Corp. will have a strong presence at the upcoming IPC Midwest Exhibition and Conference, both on the show floor and as part of the technical conference. This key industry event is scheduled for August 22-23 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL, the IPC Midwest Exhibition and Conference (www.ipcmidwestshow.org) is for electronic circuit assembly and printed-circuit-board (PCB) manufacturing professionals.


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Rogers introduces Condux Plus conductive foams

Rogers Corp.s High Performance Foams Division has introduced a new problem-solving material for handheld mobile devices — Condux Plus™ electrically conductive foam. Even in the most complex, compact handheld electronic designs, Condux Plus materials feature excellent electrical conductivity, consistent mechanical properties, and outstanding electromagnetic (EM) shielding capabilities, allowing them to serve as reliable grounding pads for handheld devices in need of enhanced conductivity and shielding performance.


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Get your Passport to IMS 2012 Montreal stamped for great prizes

Providence-based marketing communications agency Sheppard Leger Nowak Inc. (SLN) is teaming up with Transline Technology Inc. (TTI) of Anaheim, CA at the 2012 IEEE International Symposium coming up in Montreal, Canada on June 19-21 for a three-day series of fun challenges that will have lucky winners taking home some very cool electronic equipment prizes.


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Rogers appoints new president of Asia region

Rogers Corp. announced the appointment of Helen Zhang as President of Asia Region to oversee the company’s growing business in Greater China and throughout the Asia-Pacific region. Zhang will be responsible for driving Rogers’ growth strategy in Asia across the company’s three core businesses of printed circuit materials, power electronics solutions and high performance foams. 


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Rogers Corp. to display laminate solutions at DMEDS

Rogers Corp. will be offering a wide range of its high performance circuit board materials at the upcoming Del Mar Electronics & Design Show on May 2-3, 2012 at the Del Mar Fairgrounds in San Diego, CA. Representatives from Rogers Advanced Circuit Materials Division will be available at Booth #622 to help visitors obtain optimum performance using the company’s many different circuit board material offerings.


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