Articles by Rogers Corp.

Rogers Introduces New PORON Dura-shape Option

Rogers Corp. has achieved another technical first with its product line of PORON® urethanes. This unique PORON material enhancement, the Dura-Shape™ option, is a layer of polyester sealed between two layers of PORON foam, which will help fabricators produce highly accurate gaskets. This new product is the solution that...
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Rogers to Demonstrate High-performance Circuit Materials

Rogers Corp. ’s Advanced Circuit Materials Division (ACM) will demonstrate its impact on today’s – and tomorrow’s – world at the upcoming European Microwave Week trade show, scheduled for October 28-30, 2008, at the Amsterdam RAI, Hall 3, stand 313. Rogers' ACM will display examples of its high-performance circuit...
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Rogers Introduces High Voltage LED Driver

Rogers Corp. , a leader in manufacturing of high performance specialty material products, introduces its new dur-E-volt™ high voltage, constant frequency peak current mode control LED driver. Using the dur-E-volt LED driver, an LED string is driven at a fixed current that is independent of the supply voltage. This...
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Rogers Unveils New Website with Strong Customer Focus

Recognizing today’s imperative to provide succinct website content that addresses customers’ needs for real-time market and product information rather than simply projecting a company’s desired self-image, Rogers Corp. has unveiled a dynamic new site at www.rogerscorp.com . The standout new site has been designed to be customer-centric first and...
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High Frequency Circuit Materials to Meet the Needs of Today’s Complex Military and High Reliability Designs

The introduction of RT/duroid®6002 high frequency circuit material, manufactured by Rogers Corp. in the late 1980s, changed entirely what RF/microwave engineers could select for circuit board materials. Up until that time, designers seeking options of high frequency materials could select laminates with low or high dielectric constant, based on...
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Diclad Liquid Crystalline Polymer Circuit Material for Multilayer PCBs

A new liquid crystalline polymer circuit material for multilayer PCBs is featured on this month's cover
In today's age of high speed Internet, high frequency wireless and wireline communications, conventional materials are reaching their performance limits. Copper-based electrical connections are being limited by the dielectric properties of the insulating layer. Solutions using optical connections are available but are too expensive. Liquid crystalline polymers (LCP) are...
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A Bonding Prepreg for Microwave Multilayer PCBs That Uses FR-4 Processing

This month's cover features a bonding prepreg for microwave multilayer PCBs that uses FR-4 fabrication processes
A Bonding Prepreg for Microwave Multilayer PCBs That Uses FR-4 Processing Rogers Corp., Microwave Materials Division Chandler, AZ As the high performance microwave market has evolved from a low volume, military-oriented market to one dominated by large, commercial wireless applications, microwave circuit boards have also undergone a fairly dramatic...
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