Articles by Rogers Corp.

Rogers Supports PCB Supply Chain

Rogers' John Coonrod to Speak on Laminate/Prepreg Solutions for Multilayer Circuits
Rogers Corp. , known for its high-frequency, high-reliability printed circuit board materials, will be featuring its latest addition to the high-speed digital market at this year’s PCB West 2010 Exhibition (Santa Clara Convention Center, September 29, 2010). PCB West 2010, now in its 19th year, is one of the...
Read More

Rogers Teams New RO4460 Prepreg with RO4360 Laminates

Rogers Corp. Teams New RO4460 Prepreg with RO4360 Laminates

The company, a global leader in the development and manufacture of high performance, specialty-material-based products has developed the perfect prepreg match to its popular RO4360™ laminates: RO4460™ prepregs. Both materials feature consistent dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz.

Roger’s new RO4460 >>

Read More

Rogers to Showcase Thermal and Circuit Solutions at IMS

Rogers Corp. will display a selection of its materials-based solutions from two of its divisions at the upcoming 2010 IEEE International Microwave Symposium (IMS), scheduled for May 25-27, 2010, at the Anaheim Convention Center, Anaheim, CA. Rogers Advanced Circuit Materials (ACM) Division and Thermal Management Solutions (TMS) Division will...
Read More

Rogers to Spotlight Practical PCB Solutions

Rogers Corp. will turn the spotlight on some of its most versatile circuit board materials at the upcoming Del Mar Electronics & Design Show. Members of Rogers Advanced Circuit Materials Division will greet visitors to Booth 622 with circuit board solutions that deliver high performance for low cost, including...
Read More

Rogers Earns Distinguished DesignCon Paper Award

Rogers Corp. and its Advanced Circuit Materials (ACM) Division earned a distinguished DesignCon Paper Award at last month’s DesignCon 2010 Conference and Exhibition in Santa Clara, CA. The paper, “Effect of Conductor Profile on the Insertion Loss, Phase Constant, and Dispersion in Thin High-Frequency Transmission Lines,” was co-authored by...
Read More

Rogers to Exhibit Power Electronic Solutions

Two divisions of Rogers Corp. - Power Distribution Systems and Thermal Management Solutions – will be exhibiting at the upcoming Applied Power Electronics Conference (APEC) and Exposition (Booth # 235) in Palm Springs, CA, February 21-25. Rogers Power Distribution Systems will be exhibiting its RO-LINX® custom designed busbars. Rogers...
Read More

Rogers to Showcase Medical Technology Solutions

Rogers Corp. will be showcasing its Medical Technology Solutions at the upcoming MD&M show, February 9-11, 2010, in Anaheim, CA. Rogers is a specialty materials company with extensive experience in a broad range of material and process technologies that can enhance performance and patient comfort when applied to advanced...
Read More

Rogers to Showcase Advanced Material Solutions

Rogers Corp. will feature a variety of its advanced materials solutions for the electronic design and semiconductor industries at DesignCon 2010 in Santa Clara, CA (February 2-3, 2010). Members of Rogers Advanced Circuit Materials (ACM) Division will be available at booth 811 to discuss a number of innovative electronic...
Read More

Rogers Introduces PORON ThinStik Soft Seal Foam

For use in today’s ever smaller and thinner yet far more functional hand-held devices, the High Performance Foams Division of Rogers Corp. has introduced a new addition to the PORON® materials family – PORON® ThinStik™ Soft Seal. PORON ThinStik Self Adhesive Solution is an innovative impact sealing PORON Urethane...
Read More