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Articles by Rogers Corp.

Rogers Corp. to exhibit high performance circuit materials at IMS2016

Rogers Corp. is exhibiting at the 2016 IEEE MTT-S International Microwave Symposium (IMS) May 24-26, at the Moscone Center in San Francisco, Calif., Booth #2039. IEEE MTT-S IMS is the microwave industry’s largest international gathering of RF/microwave professionals, with over 600 exhibition booths and more than 8,000 attendees expected.


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Rogers Corp. introduces 92ML thermally enhanced laminates and prepregs

Rogers Corp. is pleased to introduce 92ML™ materials. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. These materials are ideal for multilayer applications requiring thermal management throughout the entire board.


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92ML™ Materials

rogers-92ML Rogers Corp. is pleased to introduce 92ML™ materials. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics.


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Rogers' PES Group to show data matrix code capabilities at PCIM Europe 2016

Rogers Corp.’s Power Electronics Solutions (PES) group will be explaining and offering examples of its extended capabilities in applying data matrix codes for its various material-based product solutions at the upcoming PCIM Europe 2016 conference and exhibition. PCIM Europe 2016, one of the top global technical conferences and exhibitions for power electronics technology, is scheduled for May 10-12, 2016 at the Nuremberg Exhibition Centre, Nuremberg, Germany.


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Rogers' PES introduces new curamik CoolPerformance Plus coolers

Rogers Corp.’s Power Electronics Solutions (PES) group has introduced its latest high-performance cooling material, curamik® CoolPerformance Plus. curamik CoolPerformance Plus is an advanced liquid-cooled material designed to dissipate large amounts of heat and provide reliable thermal management of high-power laser diodes and other heat-generating optical devices.


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Rogers Corp. to showcase advanced connectivity material solutions at IPC APEX EXPO 2016

Rogers Corp. will be exhibiting at the upcoming IPC APEX Expo scheduled for March 15-17 at the Las Vegas Convention Center, Las Vegas, Nev. Representatives from Rogers Corp. will be exhibiting at Booth #607, providing information and insight on the use of their circuit materials, including ULTRALAM® 3850HT, CLTE-XT™, TC350™ RO3003™ and XT/duroid® laminates. Rogers will also be previewing its new material system developed for extremely low loss digital applications.


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