- Buyers Guide
Articles by Rogers Corp.
Rogers Corp. advanced circuit materials division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance. COOLSPAN TECA Film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings.
Rogers Corp. will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, being held March 25-27, 2014 at the Mandalay Bay Resort & Convention Center (Las Vegas, NV). The IPC APEX EXPO, with more than 400 exhibiting companies and thousands of attendees, is a leading industry event for professionals involved in PCB design and manufacturing and electronic assembly and test.
Rogers Corp. will be promoting its high performance printed-circuit-board (PCB) materials at the DesignCon® 2014 expo. The event is being held January 29-30, 2014 at the Santa Clara Convention Center (Santa Clara, CA). The DesignCon 2014 Expo provides practical solutions for semiconductor and electronic design engineers from more than 150 of the top suppliers in the electronic industry.
Rogers Corp. Advanced Circuit Materials Division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance.
Rogers to offer material solutions for high-frequency, high-thermal-reliability & multilayer circuits at PCB West 2013
Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).
Rogers’ improved high frequency materials address several market needs. The improved RO4700JXR™ Series antenna grade laminates were designed for use in base station, RFID and other antenna designs and combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss.
Rogers Corp. Advanced Circuit Materials Division launched next generation RO4360G2™ laminates with improved thermal reliability for higher UL MAXIMUM OPERATING TEMPERATURES (MOTs).
Rogers Corp. will highlight several of its high quality printed circuit board (PCB) materialsat the upcoming 2013 IEEE International Microwave Symposium (IMS). Rogers’ Advanced Circuit Materials representatives will be on hand at exhibition booth #1459. In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from Phase Measurements.” as part of the technical program.
Rogers to display latest high frequency material advances for digital and analog circuit designers at the 2013 Del Mar Electronics & Design Show
Rogers Corp., a supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its advanced printed circuit board (PCB) materials at the upcoming Del Mar Electronics & Design Show (www.vts.com/delmar).
Rogers Corp., represented by its High Performance Foams Division (HPF), will be exhibiting its Silfx™ lightweight silicone comfort foam at the upcoming Aircraft Interiors Expo 2013.