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Articles by Rogers Corp.

Rogers Corp. signs definitive agreement to acquire Arlon, LLC

Rogers Corp., a global leader in engineered materials solutions, announced it has signed a definitive agreement to acquire Arlon, LLC, currently owned by Handy & Harman Ltd., for $157 million, subject to closing and post-closing adjustments. The transaction, which is subject to regulatory clearances, is expected to close in the first half of 2015. 


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Rogers Corp. introduces RO3000 laminates with rolled copper foils

 Rogers Corp.’s Advanced Circuit Materials Division, a global leader in Microwave Printed Circuit Board (PCB) Materials, recently introduced rolled copper cladding options with its RO3003™, RO3035™ and RO3203™ low dielectric constant laminate materials 


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Rogers Corp. launches free app for apple and android devices

 Rogers Corp.’s Advanced Circuit Materials Division launched ROG Mobile, a free mobile app for apple and android devices. The new app allows users to access Rogers’ calculators, including the popular MWI (Microwave Impedance) simulation tool, literature, technical papers and the ability to order samples, all while on the go with their smart phones and tablets. 


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Rogers Corp. offers material solutions for wide range of circuits at PCB West 2014

 Rogers Corp. will be showing some of its high-performance electronic printed-circuit-board (PCB) materials and offering advice on optimum ways to use them at the upcoming PCB West Exhibition (http://pcbwest.com), September 10, 2014, at the Santa Clara Convention Center, Santa Clara, Calif. 


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Rogers’ advanced circuit-material solutions to be on display at IMS

Rogers Corp. and representatives of the company’s Advanced Circuit Materials division (ACM) will be present at the 2014 IEEE International Microwave Symposium (IMS) June 3-5 to help attendees learn more about Rogers' wide range of high frequency circuit materials.


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Rogers Corp. releases video on innovation center opening

Rogers Corp. held a ribbon-cutting ceremony to dedicate the company’s new Innovation Center in Burlington, Massachusetts on March 25. More than 125 government officials, community leaders, technology company representatives and other guests were on hand to celebrate and tour the Center, which is located within Northeastern University’s George J. Kostas Research Institute for Homeland Security.


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Rogers to exhibit high performance materials at Del Mar Electronics Show

Rogers Corp. will be showing samples of the company’s wide range of industry-leading printed-circuit-board (PCB) materials at the Del Mar Electronics & Design Show April 30-May 1, 2014 at the Del Mar Fairgrounds in San Diego, CA.


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Thermally / Electrically Conductive Adhesive (TECA) Film

TECA FilmRogers Corp. advanced circuit materials division launched COOLSPAN® thermally & electrically conductive adhesive (TECA) film providing reliable high temperature performance. COOLSPAN TECA film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings.


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Rogers highlights latest circuit materials & PCB techniques at IPC APEX EXPO

Rogers Corp. will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, being held March 25-27, 2014 at the Mandalay Bay Resort & Convention Center (Las Vegas, NV). The IPC APEX EXPO, with more than 400 exhibiting companies and thousands of attendees, is a leading industry event for professionals involved in PCB design and manufacturing and electronic assembly and test.


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Rogers highlights materials high performance circuits at DesignCon 2014

Rogers Corp. will be promoting its high performance printed-circuit-board (PCB) materials at the DesignCon® 2014 expo. The event is being held January 29-30, 2014 at the Santa Clara Convention Center (Santa Clara, CA). The DesignCon 2014 Expo provides practical solutions for semiconductor and electronic design engineers from more than 150 of the top suppliers in the electronic industry.


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