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Articles by Rogers Corp.

PCB Materials: RO4835™ and RO4360G2™

RO4835â?¢ and RO4360G2â?¢Rogers RO4835 high frequency laminates, specially formulated with improved oxidation resistance, were developed for applications needing improved stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. RO4360G2 laminates have a tailored high Dk of 6.15 at 10 GHz, which allows next generation power amplifier designers to meet size and cost reduction targets


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Liquid-Crystal-Polymer Laminates: ULTRALAM 3850HT

Rogers Corp. unveiled its ULTRALAM® 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, ULTRALAM 3850HT circuit materials are adhesiveless laminates that use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications.


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Rogers Corp. signs definitive agreement to acquire Arlon, LLC

Rogers Corp., a global leader in engineered materials solutions, announced it has signed a definitive agreement to acquire Arlon, LLC, currently owned by Handy & Harman Ltd., for $157 million, subject to closing and post-closing adjustments. The transaction, which is subject to regulatory clearances, is expected to close in the first half of 2015. 


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RO3003™ Laminates

RO3003(TM) Laminates

Rogers Corp. has introduced rolled copper cladding options including the RO3003™ high frequency circuit material. This is a ceramic-filled PTFE composite intended for use in commercial microwave and RF applications. RO3003 has excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GHz.


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