Articles by Rogers Corp.
February 5, 2010
Rogers Corp. will be showcasing its Medical Technology Solutions at the upcoming MD&M show, February 9-11, 2010, in Anaheim, CA. Rogers is a specialty materials company with extensive experience in a broad range of material and process technologies that can enhance performance and patient comfort when applied to advanced...
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January 8, 2010
Rogers Corp. will feature a variety of its advanced materials solutions for the electronic design and semiconductor industries at DesignCon 2010 in Santa Clara, CA (February 2-3, 2010). Members of Rogers Advanced Circuit Materials (ACM) Division will be available at booth 811 to discuss a number of innovative electronic...
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December 9, 2009
For use in today’s ever smaller and thinner yet far more functional hand-held devices, the High Performance Foams Division of Rogers Corp. has introduced a new addition to the PORON® materials family – PORON® ThinStik™ Soft Seal. PORON ThinStik Self Adhesive Solution is an innovative impact sealing PORON Urethane...
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October 28, 2009
Rogers Corp. will display a number of its innovative and practical materials solutions for microelectronics packaging and production at the upcoming IMAPS 2009 Conference and Exhibition in San Jose, CA (November 3-5, 2009, at the San Jose Convention Center). Rogers will be represented by both its Advanced Circuit Materials...
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October 22, 2009
The High Performance Foams Division of Rogers Corp. has created an online design guide that helps designers select the proper Rogers BISCO® Silicones for use in railcar floating floor designs and systems. Use of the Floating Floor Online Design Guide will assist transportation engineers and designers in quickly evaluating...
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October 14, 2009
Rogers Corp. will highlight some of its latest material advances at the upcoming Productronica in Munich, Germany, November 10-13, 2009, a major international trade fair for innovations in electronics production. Rogers Advanced Circuit Materials Division will display many of its recent innovations in materials for low-cost, high-volume production lines....
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September 21, 2009
Rogers Corp. , a supplier of high frequency laminates will be promoting recently introduced products at the European Microwave Exhibition, booth # 514, September 29 – October 1. RT/duroid® 5880LZ materials have the lowest Dk for a copper clad laminate available in the market today. Because of its low...
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September 11, 2009
The Advanced Circuit Materials (ACM) Division of Rogers Corp. has introduced RO4360™ laminates, developed for the special requirements of high-frequency amplifier designers. RO4360 laminates feature a dielectric constant of 6.15 and loss of 0.003 at 2.5 GHz. The laminates are based on a ceramic-filled, thermoset resin system reinforced by...
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September 9, 2009
The Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced its RO3730™ laminates, tailored for the special needs of high-frequency antenna designers requiring cost-effective PTFE laminates. These ceramic-filled laminate materials are reinforced by woven fiber glass with optimized glass and filler loading for excellent structural stability and outstanding...
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September 8, 2009
Rogers Corp. , a supplier of high-frequency laminates for circuit boards in amplifiers, microwave radios, base-station antennas, and routers and switches, showcases a number of its high-performance and low-cost laminate materials for commercial and military applications at the upcoming PCB West 2009 this September 15-16 in Santa Clara, CA...
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