Articles by Rogers Corp.
January 17, 2011
RT/duroid® 5880LZ materials have the lowest Dk for a copper clad laminate available in the market today. Because of its low dielectric constant of 1.96 at 10 GHz, RT/duroid 5880LZ supports broadband applications at the microwave through millimeter-wave frequencies where dispersion and circuit losses must be minimized. It is a lightweight, PTFE-based composite optimized with a unique filler that provides very low density (1.37 gm/cm3).
January 17, 2011
Rogers Corporation has achieved another technical first with its product line of PORON® urethanes. This unique PORON material enhancement, the Dura-Shape™ option, is a layer of polyester sealed between two layers of PORON foam which will help fabricators produce highly accurate gaskets. This new product is the solution that fabricators have been seeking in terms of improved die cutting for high performance gaskets and seals.
January 5, 2011
Rogers Advanced Circuits Materials Division (ACM) will be introducing two new laminates to the market at the IEEE Radio & Wireless Week expo at the Renaissance Glendale Hotel & Spa in Glendale, AZ, January 17-18, 2011. Rogers (Booth #2) will be featuring its new XT/duroid™ 8000 series high performance...Read More
December 15, 2010
Rogers Corp. has introduced RT/duroid® 6035HTC, a new high-thermal-conductivity (HTC) laminate material engineered for low loss in high-power circuits. The fluoropolymer composite material is ideal for RF and microwave applications in military and high-reliability (hi-rel) applications required to handle high power levels, such as power amplifiers. Rogers RT/duroid 6035HTC...Read More
December 3, 2010
The Power Distribution Systems (PDS) Division of Rogers Corp. has been awarded International Railway Industry Standard (IRIS) certification for its laminated busbar manufacturing facility located in the Suzhou Industrial Park in Jiangsu Province, China. The Rogers PDS-China manufacturing facility is the first laminated busbar manufacturer in China to obtain...Read More
November 24, 2010
Rogers Corp. will be highlighting a blend of proven and new materials solutions at the upcoming Defense Manufacturing Conference 2010 (DMC 2010), November 29-December 1, to be held at The Venetian, in Las Vegas, NV. Representatives from Rogers Advanced Circuit Materials (ACM) Division will be available at Booth #1001...Read More
November 18, 2010
Rogers Corp. announced that it has signed an agreement with PolyWorks Corp. of North Smithfield, RI, to license PolyWorks’ technology for molding Rogers’ industry-leading high performance foam brand, PORON microcellular polyurethanes, into three-dimensional shapes. The agreement, finalized on November 2, 2010, stems from a multi-year joint development effort to...Read More
October 29, 2010
As the demand for thinner, larger and more expensive LCD displays continues to grow, designers and manufacturers face new challenges with these increasingly complex technologies. Rogers Corp. ’s newest offering - PORON® ShockSeal foams - are specifically engineered to meet the challenging cushioning, sealing and protection requirements that larger...Read More
October 21, 2010
Impact protection has come a long way from the days of steel armor. New technologies that seem like science fiction will be showcased during the 7th International Conference of Safety and Protective Fabrics to be held on Tuesday, October 26th, at the Orange County Convention Center in Orlando, FL....Read More
September 28, 2010
Rogers Corp. will be showcasing its high performance, cost-effective laminate materials for antenna applications at the upcoming Antenna Systems 2010 conference and expo (October 19-20, 2010, Gaylord Texan Resort & Convention Center, Dallas, TX). Representatives from Rogers Advanced Circuit Materials (ACM) Division will be present at Booth #104 to...Read More