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Articles by Rogers Corp.

Rogers Opens New Circuit Materials Production Facility in China

May 5, 2011
Rogers Corp.’s Advanced Circuit Materials Division (ACMD) opened a new production facility April 13 in Asia, one of its largest market regions. Rogers’ new ACMD Suzhou, China manufacturing facility represents a major investment in the modern China Suzhou Innovation Park. This ACMD dedicated production facility significantly increases Rogers’ global...
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Rogers Assists Circuit Designer with Free Impedance Calculator Software

April 8, 2011
Rogers Corp. is offering the newest version of its simple, but powerful Microwave Impedance Calculator, MWI-2010. Available for free download from the company’s website at www.rogerscorp.com/acm/index.aspx , this handy program provides fast and easy calculations of key transmission-line parameters based on Rogers’ extensive lines of high frequency circuit materials....
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Rogers to Display Material Solutions Spanning RF to Digital PCBS

March 17, 2011
Rogers Corp. will display a sampling of its wide array of electronic printed-circuit-board (PCB) material solutions at the IPC APEX EXPO™ in Las Vegas, NV (April 12-14, 2011) at the Mandalay Bay Resort & Convention Center. Rogers will feature materials ideally suited for RF as well as digital applications,...
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Rogers' Bisco Silicone Materials on Display

March 15, 2011
Rogers Corp. ’s High Performance Foams Division will be exhibiting its BISCO® silicone materials at the upcoming Aircraft Interiors Expo at the Hamburg Messe (Booth #6A40), April 5-7, 2011. BISCO® materials on display include the A2 Sound Barrier material, BF-1000 premium carpet padding, and the next generation development aircraft...
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Rogers Introduces High Temperature Thermoplastic Circuit Materials

March 2, 2011
Rogers Corp. announced its new SYRON® 7000 and 7100 high-performance circuit materials, engineered for applications that demand outstanding high-temperature stability. These innovative thermoplastic circuit laminates are characterized by a considerably higher melt temperature than PTFE circuit materials, with an estimated Underwriters’ Laboratory (UL) relative thermal index (RTI) of greater...
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Rogers to Offer Power Distribution and Thermal Management Solutions

March 1, 2011
Rogers Corp. will be in full force at the upcoming Applied Power Electronics Conference (APEC) and Expo in the Fort Worth Convention Center, Fort Worth, TX, March 7-9, 2011. APEC 2011 is an international conference and exhibition devoted to applied power electronics. Representatives from Rogers Power Distribution Systems (PDS)...
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Rogers to Showcase Advanced Materials Solutions

February 16, 2011
Rogers Corp. will be displaying a trio of its top materials for space and satellite communications applications at the upcoming SATELLITE 2011 exhibition. SATELLITE 2011, celebrating its 30th year of service to satellite end-user professionals in broadcast, commercial, military, enterprise and telecommunications areas, expects nearly 10,000 attendees to the...
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Rogers Corp. Launches New Career Center Utilizing Social Media

January 28, 2011
In a move to employ social media to assist career development within the engineering community, Rogers Corp. has launched a social media program engaging online communities such as Facebook, Twitter, LinkedIn and YouTube. The social media presences are linked to the new Rogers Corp. US Careers Center page at...
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Rogers Promotes Halogen-free Laminates and Free Design Software

January 18, 2011
Rogers Corp. will be showing off some of its latest materials as well as a free design program at this year’s DesignCon® 2011 exhibition (Santa Clara Convention Center, Santa Clara, CA, February 1-2, 2011). DesignCon, the first major electronics industry event of the year, is a key forum for...
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PowerCircuit™ Busbars

January 17, 2011

BusbarRogers Corp.’s Power Distribution Systems Division has announced an innovative new solution for emerging power electronics applications: RO-LINX® PowerCircuit™ busbars. The PowerCircuit solution was developed to meet the growing power distribution demands in electric vehicle (EV) drives, hybrid electric vehicle (HEV) drives and related charging systems.


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