Articles by Rogers Corp.

Rogers Corp. will be exhibiting at the 2012 European Microwave Week on October 29 through the 31st, at the Amsterdam RAI Exhibition and Convention Centre (Amsterdam, The Netherlands). European Microwave Week (www.eumweek.com) consists of three major conferences — the European Microwave Conference (EuMC), the European Microwave Integrated Circuits Conference (EuMIC), and the European Radar Conference (EuRAD), as well as a three day exhibition from October 29-31, 2012.

Families in Northeastern Connecticut are gearing up for a fun day of activities to help combat hunger by attending the first annual Harvest for Hunger event, Sunday, October 14, at Fort Hill Farms in Thompson, CT. Sponsored by the employees of Rogers Corp. and Fort Hill Farms, the event will be held from 11 a.m. to 5 p.m. A variety of fund-raising activities at the event will benefit Connecticut Food Bank’s mobile pantry and food programs of Thompson Ecumenical Empowerment Group (TEEG).

Rogers Corp. will be participating in the PCB West 2012 Conference & Exhibition in both the technical program and the exhibition floor. The PCB West 2012 Conference & Exhibition (www.pcbwest.com) features a three-day technical conference (September 25-27) and one-day exhibition hall (September 26). Rogers Corporation (www.rogerscorp.com) welcomes visitors to join them for the PCB West 2012 Conference & Exhibition to learn more about the practical use of its high performance PCB materials.

Rogers Corp. will be displaying three of its leading high-performance circuit materials for mobile and fixed-site antennas at the upcoming Mobile Antenna Systems 2012 conference and exhibition. This key event for designers and specifiers of antennas for a wide range of fixed and mobile applications is scheduled for September 18-19, 2012 at the Hyatt Denver Tech Center (Denver, CO).

Rogers Corp.’s High Performance Foams Division will be exhibiting its range of performance material solutions for railcar applications at the upcoming Innotrans international fair for transport technology, September 18-21, in Berlin (Rogers location at Stand 101 in Hall 3.1).

Rogers Corp. will have a strong presence at the upcoming IPC Midwest Exhibition and Conference, both on the show floor and as part of the technical conference. This key industry event is scheduled for August 22-23 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL, the IPC Midwest Exhibition and Conference (www.ipcmidwestshow.org) is for electronic circuit assembly and printed-circuit-board (PCB) manufacturing professionals.

Rogers Corp.s High Performance Foams Division has introduced a new problem-solving material for handheld mobile devices — Condux Plus™ electrically conductive foam. Even in the most complex, compact handheld electronic designs, Condux Plus materials feature excellent electrical conductivity, consistent mechanical properties, and outstanding electromagnetic (EM) shielding capabilities, allowing them to serve as reliable grounding pads for handheld devices in need of enhanced conductivity and shielding performance.

Providence-based marketing communications agency Sheppard Leger Nowak Inc. (SLN) is teaming up with Transline Technology Inc. (TTI) of Anaheim, CA at the 2012 IEEE International Symposium coming up in Montreal, Canada on June 19-21 for a three-day series of fun challenges that will have lucky winners taking home some very cool electronic equipment prizes.

Rogers Corp. and representatives of its Advanced Circuit Materials Division will be at the upcoming 2012 IEEE International Microwave Symposium (IMS) to help attendees learn more about Rogers’ wide range of high frequency circuit materials.

Rogers Corp. announced the appointment of Helen Zhang as President of Asia Region to oversee the company’s growing business in Greater China and throughout the Asia-Pacific region. Zhang will be responsible for driving Rogers’ growth strategy in Asia across the company’s three core businesses of printed circuit materials, power electronics solutions and high performance foams.