Articles by Rogers Corp.

Rogers to Spotlight Practical PCB Solutions

Rogers Corp. will turn the spotlight on some of its most versatile circuit board materials at the upcoming Del Mar Electronics & Design Show. Members of Rogers Advanced Circuit Materials Division will greet visitors to Booth 622 with circuit board solutions that deliver high performance for low cost, including...
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Rogers Earns Distinguished DesignCon Paper Award

Rogers Corp. and its Advanced Circuit Materials (ACM) Division earned a distinguished DesignCon Paper Award at last month’s DesignCon 2010 Conference and Exhibition in Santa Clara, CA. The paper, “Effect of Conductor Profile on the Insertion Loss, Phase Constant, and Dispersion in Thin High-Frequency Transmission Lines,” was co-authored by...
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Rogers to Exhibit Power Electronic Solutions

Two divisions of Rogers Corp. - Power Distribution Systems and Thermal Management Solutions – will be exhibiting at the upcoming Applied Power Electronics Conference (APEC) and Exposition (Booth # 235) in Palm Springs, CA, February 21-25. Rogers Power Distribution Systems will be exhibiting its RO-LINX® custom designed busbars. Rogers...
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Rogers to Showcase Medical Technology Solutions

Rogers Corp. will be showcasing its Medical Technology Solutions at the upcoming MD&M show, February 9-11, 2010, in Anaheim, CA. Rogers is a specialty materials company with extensive experience in a broad range of material and process technologies that can enhance performance and patient comfort when applied to advanced...
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Rogers to Showcase Advanced Material Solutions

Rogers Corp. will feature a variety of its advanced materials solutions for the electronic design and semiconductor industries at DesignCon 2010 in Santa Clara, CA (February 2-3, 2010). Members of Rogers Advanced Circuit Materials (ACM) Division will be available at booth 811 to discuss a number of innovative electronic...
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Rogers Introduces PORON ThinStik Soft Seal Foam

For use in today’s ever smaller and thinner yet far more functional hand-held devices, the High Performance Foams Division of Rogers Corp. has introduced a new addition to the PORON® materials family – PORON® ThinStik™ Soft Seal. PORON ThinStik Self Adhesive Solution is an innovative impact sealing PORON Urethane...
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Rogers to Showcase Advanced Materials at Productronica 2009

Rogers Corp. will highlight some of its latest material advances at the upcoming Productronica in Munich, Germany, November 10-13, 2009, a major international trade fair for innovations in electronics production. Rogers Advanced Circuit Materials Division will display many of its recent innovations in materials for low-cost, high-volume production lines....
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