Articles by Taconic Advanced Dielectric Division
July 16, 2004
The use of polytetraflouroethylene (PTFE) as a dielectric substrate represents a mature technology in the field of RF/microwave circuit design. The growth in cellular communication infrastructure during the latter part of the twentieth century placed demands on laminated substrate manufacturers to develop both the capacity and products to make...
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Introduction to a high performance, low loss laminate material for microwave telecommunications and high speed digital printed circuit board (PCB) applications
May 1, 2002
Product Feature A Low Loss PTFE-based Bond Ply Material for Multi-layer PCB Applications Taconic Advanced Dielectric Division Petersburgh, NY Growing needs are developing for pure package high performance, low loss laminate and prepreg materials for microwave telecommunications and high speed digital printed circuit board (PCB) applications. Polytetrafluoroethylene (PTFE), perhaps...
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Copper clad substrate material that is formulated to combine the property advantages of fluoropolymer organic chemistry with ceramic elements
July 1, 2000
PRODUCT FEATURE ORGANIC CERAMIC MICROWAVE SUBSTRATE MATERIALS TACONIC ADVANCED DIELECTRIC DIVISION Petersburgh, NY The ORCER family of copper clad substrate material is formulated to combine the property advantages of fluoropolymer organic chemistry with ceramic elements. The development of this technology has enabled the creation of a wide range of...
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A polytetraflouroethylene-based RF/microwave substrate for high frequency applications
September 1, 1998
A High Performance, Economical RF/Microwave Substrate Taconic, Advanced Dielectric Division Petersburgh, NY During the past decade, the wireless industry has evolved from a predominantly military-driven market to a cost-conscious, consumer-driven commercial market. At the same time, wireless applications are moving up in the frequency spectrum. For example, personal communications...
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