The Economics of GaAs and CMOS PAs: Crunch Time
Design and Test Challenges for Next-Generation 802.11ac, ad WLAN Standards
CoMP: The Most Challenging Technology Component in LTE-Advanced 3GPP Release 11
Investigates the effect of noise propagation in a multilayer PCB, due to the close proximity of two PWR planes and provides an overview on the design of the power bus location on multilayer PCBs
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