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ARTICLES

Aluminum Diamond Heat Spreader Material for GaN Devices

Nano Materials International, Tucson, AZ
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Nano Materials International has introduced aluminum diamond metal matrix composites (MMC) for use as heat spreaders that can reduce GaN junction temperatures by up to 25 percent, has a coefficient of thermal expansion (CTE) close to that of SiC and metallization well suited for die attach. They also have...
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