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Tektronix Component Solutions and MOSIS ink ASIC services agreement

Tektronix Component Solutions
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Tektronix Component Solutions, a custom microelectronics services provider, announced an agreement with leading supply chain aggregator MOSIS to help customers develop complete, high-performance ASIC solutions while reducing the cost of early-stage ASIC development. Through the use of multi-project wafer runs for device prototyping and package development early in the design cycle, customers can costeffectively improve the time to first packaged ASIC.


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Tektronix Selects Teradyne J750 Semiconductor Test Systems

Tektronix Component Solutions
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At IMS 2011, Tektronix Component Solutions (Booth 1432) announced the investment in five new Teradyne J750EX semiconductor test systems to allow screening of a wider variety of complex ASICs, increase test capacity and enable faster development of new test programs. Reducing development time will improve time-to-test for customers and...
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