Tektronix Component Solutions and MOSIS ink ASIC services agreement

Tektronix Component Solutions, a custom microelectronics services provider, announced an agreement with leading supply chain aggregator MOSIS to help customers develop complete, high-performance ASIC solutions while reducing the cost of early-stage ASIC development. Through the use of multi-project wafer runs for device prototyping and package development early in the design cycle, customers can costeffectively improve the time to first packaged ASIC.

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