Smiths Interconnectannounces the release of the Volta Series probe heads optimized for wafer level chip scale package testing. Volta is used for testing the chips (while in their wafer form) that are behind everything from Bluetooth and power management to digital display controllers. Volta helps customers deliver higher quality products by ensuring the chips in them are up to specification, and perform as they should.
Smiths Interconnect, a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products, announces today the release of the Volta Series probe heads optimized for wafer level chip scale package testing.
Smiths Interconnect announces the Millitech brand HPC Series of high-power circulators. Smiths Interconnect will be in Booth #1441 at IMS2017 June 6- 8 in Honolulu reviewing these and other microwave and mmWave solutions.
Smiths Interconnect, a division of Smiths Group plc, announced it is unifying its technology brands of EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK under the single brand identity of ‘Smiths Interconnect’.
Smiths Interconnect announces the appointment of Andy Humen as president of Smiths Interconnect Microwave, one of three operational business units alongside Smiths Interconnect Connectors and Smiths Interconnect Power.
Smiths Interconnect , a division of Smiths Group, announced at the Mobile World Congress in Barcelona, Spain, that it will combine the four existing businesses within the Smiths Interconnect Wireless Technologies Group ( Summitek , Allrizon , Triasx and the telecom division of TRAK Microwave Ltd. ) under the...