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Articles by IKE Micro/Bonding Source

IKE Micro completes in-house air cavity array packaging capability

IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies. 


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IKE Micro/Bonding Source Move to New Facility

IKE Micro and its sister company Bonding Source have moved into a newly refurbished facility, doubling their capacity. The 14,000 square foot IKE Micro facility includes a 3,200 Class 10,000 clean room, ESD flooring in the clean room and SMT areas, a larger material handling area for additional turnkey...
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