Articles by Chien-Cheng Wei, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu and Shao-Pin Ru, Tong Hsing Electronic Industries Ltd.Taipei Hsien, Taiwan

Direct Plated Copper Metallized Substrate and Its Application on Microwave Circuits

A direct plated copper (DPC) metallized substrate technique is introduced and characterized in this article. The proposed DPC metallized substrate provides the main advantages of excellent thermal management and high-frequency characteristics, due to t...
The direct plated copper (DPC) process on metallized ceramic substrate was originally created to replace the direct bonded copper (DBC) process because of its better electrical, thermal and mechanical performance. 1 Compared to DBC, DPC provides a very strong bond strength between the Al2O3/AlN substrate and the copper metal,...
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